MCF5307AI90B Freescale Semiconductor, MCF5307AI90B Datasheet - Page 16

• Manufacturer Part Number: MCF5307AI90B
• Description: IC MPU 32BIT COLDF 90MHZ 208FQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF530xr

Specifications of MCF5307AI90B

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 90MHz
• Connectivity: EBI/EMI, I²C, UART/USART
• Peripherals: DMA, POR, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 208-FQFP
• Maximum Clock Frequency: 90 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 90MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 208
• Package Type: FQFP
• Program Memory Size: 8KB
• Cpu Speed: 90MHz
• Embedded Interface Type: I2C, UART
• Digital Ic Case Style: FQFP
• No. Of Pins: 208
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Paragraph
Number
17.5.5.3
17.5.6
17.5.7
17.5.8
17.6
17.6.1
17.6.2
17.6.3
17.7
17.7.1
17.7.2
17.7.3
17.7.4
17.7.5
17.7.6
17.7.7
17.8
17.8.1
17.9
17.9.1
17.9.2
17.9.3
17.9.4
17.10
17.10.1
17.10.2
17.11
17.12
17.12.1
17.12.2
17.13
17.13.1
17.13.2
17.13.3
17.13.4
17.13.5
17.14
17.14.1
17.14.2
17.14.3
17.14.4
17.14.5
xvi
Chip-Select Module Signals ........................................................................... 17-15
DRAM Controller Signals .............................................................................. 17-16
DMA Controller Module Signals.................................................................... 17-17
Serial Module Signals ..................................................................................... 17-18
Timer Module Signals..................................................................................... 17-18
Parallel I/O Port (PP[15:0]) ............................................................................ 17-19
I2C Module Signals ........................................................................................ 17-19
Debug and Test Signals .................................................................................. 17-20
Debug Module/JTAG Signals......................................................................... 17-21
D4—Address Configuration (ADDR_CONFIG) ....................................... 17-14
D[3:2]—Frequency Control PLL (FREQ[1:0] ..........................................) 17-15
D[1:0]—Divide Control PCLK to BCLKO (DIVIDE[1:0])....................... 17-15
Chip-Select (CS[7:0]) ................................................................................. 17-16
Byte Enables/Byte Write Enables (BE[3:0]/BWE[3:0]) ............................ 17-16
Output Enable (OE) .................................................................................... 17-16
Row Address Strobes (RAS[1:0])............................................................... 17-16
Column Address Strobes (CAS[3:0]) ......................................................... 17-16
DRAM Write (DRAMW)........................................................................... 17-17
Synchronous DRAM Column Address Strobe (SCAS) ............................. 17-17
Synchronous DRAM Row Address Strobe (SRAS)................................... 17-17
Synchronous DRAM Clock Enable (SCKE) .............................................. 17-17
Synchronous Edge Select (EDGESEL) ...................................................... 17-17
DMA Request (DREQ[1:0]/PP[6:5]).......................................................... 17-18
Transmitter Serial Data Output (TxD)........................................................ 17-18
Receiver Serial Data Input (RxD)............................................................... 17-18
Clear to Send (CTS).................................................................................... 17-18
Request to Send (RTS) ............................................................................... 17-18
Timer Inputs (TIN[1:0]).............................................................................. 17-19
Timer Outputs (TOUT1, TOUT0) .............................................................. 17-19
I2C Serial Clock (SCL)............................................................................... 17-19
I2C Serial Data (SDA)................................................................................ 17-19
Test Mode (MTMOD[3:0]) ........................................................................ 17-20
High Impedance (HIZ)................................................................................ 17-20
Processor Clock Output (PSTCLK)............................................................ 17-20
Debug Data (DDATA[3:0])........................................................................ 17-20
Processor Status (PST[3:0])........................................................................ 17-20
Test Reset/Development Serial Clock (TRST/DSCLK) ............................ 17-21
Test Mode Select/Breakpoint (TMS/BKPT) .............................................. 17-22
Test Data Input/Development Serial Input (TDI/DSI) ............................... 17-22
Test Data Output/Development Serial Output (TDO/DSO)....................... 17-22
Test Clock (TCK) ....................................................................................... 17-23
D[6:5]—Port Size Configuration (PS_CONFIG[1:0]) ........................... 17-14
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
MCF5307 User’s Manual
CONTENTS
Title
Number
Page