LPC1113FHN33/302,5 NXP Semiconductors, LPC1113FHN33/302,5 Datasheet - Page 42

• Manufacturer Part Number: LPC1113FHN33/302,5
• Description: IC MCU LV 32BIT 24K FLAS 32VQFN
• Manufacturer: NXP Semiconductors
• Series: LPC1100Lr

Specifications of LPC1113FHN33/302,5

• Featured Product: LPC1100L 32-Bit MCU
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad
• Processor Series: LPC1113
• Core: ARM Cortex-M0
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, UART, SPI, SSP
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 42
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-5148

NXP Semiconductors
LPC1111_12_13_14
Product data sheet
Fig 15. Sleep mode: Typical supply current I
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(mA)
I
DD
Conditions: V
SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled; low-current mode.
clock frequencies (for LPC111x/102/202/302)
6
4
2
0
−40
All information provided in this document is subject to legal disclaimers.
DD
Rev. 4 — 10 February 2011
= 3.3 V; sleep mode entered from flash; all peripherals disabled in the
−15
10
DD
versus temperature for different system
32-bit ARM Cortex-M0 microcontroller
35
LPC1111/12/13/14
48 MHz
36 MHz
24 MHz
12 MHz
(2)
(2)
(2)
(1)
60
temperature (°C)
002aaf982
© NXP B.V. 2011. All rights reserved.
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