LPC1113FHN33/302,5 NXP Semiconductors, LPC1113FHN33/302,5 Datasheet - Page 45

• Manufacturer Part Number: LPC1113FHN33/302,5
• Description: IC MCU LV 32BIT 24K FLAS 32VQFN
• Manufacturer: NXP Semiconductors
• Series: LPC1100Lr

Specifications of LPC1113FHN33/302,5

• Featured Product: LPC1100L 32-Bit MCU
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad
• Processor Series: LPC1113
• Core: ARM Cortex-M0
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, UART, SPI, SSP
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 42
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-5148

NXP Semiconductors
LPC1111_12_13_14
Product data sheet
9.5 Electrical pin characteristics
Fig 18. High-drive output: Typical HIGH-level output voltage V
Fig 19. I
(mA)
V
I
(V)
OL
OH
3.6
3.2
2.8
2.4
60
40
20
Conditions: V
output current I
Conditions: V
LOW-level output voltage V
2
2
0
C-bus pins (high current sink): Typical LOW-level output current I
0
0
All information provided in this document is subject to legal disclaimers.
DD
DD
10
Rev. 4 — 10 February 2011
= 3.3 V; on pin PIO0_7.
= 3.3 V; on pins PIO0_4 and PIO0_5.
OH
T = 85 °C
.
−40 °C
25 °C
0.2
20
OL
30
32-bit ARM Cortex-M0 microcontroller
LPC1111/12/13/14
T = 85 °C
0.4
40
−40 °C
25 °C
OH
V
versus HIGH-level
OL
50
(V)
I
OH
002aae990
002aaf019
© NXP B.V. 2011. All rights reserved.
(mA)
OL
0.6
60
versus
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