IMU-3000 INVENSENSE, IMU-3000 Datasheet - Page 48

• Manufacturer Part Number: IMU-3000
• Description: GYRO, TRI-AXIS, PROG +/-2000 DEG/S
• Manufacturer: INVENSENSE

Specifications of IMU-3000

• No. Of Axes: 3
• Sensor Case Style: QFN
• No. Of Pins: 24
• Supply Voltage Range: 2.1V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Interface: I2C, Serial
• Interface Type: I2C, Serial
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
The IMU-3000 gyroscope has a shock tolerance of 10,000g. InvenSense packages its gyroscopes as it
deems proper for protection against normal handling and shipping. It recommends the following handling
precautions to prevent potential damage.
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11.7
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
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11.8 Gyroscope Surface Mount Guidelines
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of
restricted RoHS elements or compounds. Pb-free solders should be used for assembly.
In order to assure gyroscope performance, several industry standard guidelines need to be considered for
surface mounting. These guidelines are for both printed circuit board (PCB) design and surface mount
assembly and are available from packaging and assembly houses.
When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting and
assembly could affect the output offset and its value over a wide range of temperatures. This is caused by
the mismatch between the Coefficient Temperature Expansion (CTE) of the package material and the PCB.
Care must be taken to avoid package stress due to mounting.
Individually packaged or trays of gyroscopes should not be dropped onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
The Tape-and-Reel moisture-sealed bag is an ESD approved barrier. The best practice is to keep the
units in the original moisture sealed bags until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge, or
better, to less than 150V. Ensure that all workstations are properly grounded.
Store ESD sensitive devices in ESD safe containers until ready for use.
Ensure that personnel are properly grounded to prevent ESD.
ESD Considerations
IMU-3000 Product Specification
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Document Number: PS-IMU-3000A-00-01.1
Revision: 1.1
Release Date: 08/19/2010