LPC2378FBD144 NXP Semiconductors, LPC2378FBD144 Datasheet - Page 39

• Manufacturer Part Number: LPC2378FBD144
• Description: MCU 32BIT ARM7, 10/100, USB, CAN
• Manufacturer: NXP Semiconductors

Specifications of LPC2378FBD144

• Core Size: 32bit
• No. Of I/o's: 104
• Program Memory Size: 512KB
• Ram Memory Size: 58KB
• Cpu Speed: 72MHz
• Oscillator Type: External, Internal
• No. Of Timers: 4
• No. Of Pwm Channels: 6
• Digital Ic Case: RoHS Compliant
• Controller Family/series: LPC23xx
• Rohs Compliant: Yes

NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC2377_78
Product data sheet
Symbol
T
DD
j(max)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
−
=
T
R
P
40
amb
th(j-a)
D
T
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
= the package junction-to-ambient thermal resistance (°C/W)
+
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
–
Rev. 5 — 17 June 2010
)
)
j
(°C), can be calculated using the following
Single-chip 16-bit/32-bit microcontrollers
Min
-
DD
and V
DD
Typ
-
. The I/O power dissipation of
LPC2377/78
Max
125
© NXP B.V. 2010. All rights reserved.
Unit
°C
39 of 68
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