EP3SL150F780I3N Altera, EP3SL150F780I3N Datasheet - Page 59

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EP3SL150F780I3N

Manufacturer Part Number
EP3SL150F780I3N
Description
Stratix III
Manufacturer
Altera
Datasheet

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Introduction
Row
Interconnects
Altera Corporation
October 2007
SIII51003-1.1
Stratix
architecture to implement custom logic. A series of column and row
interconnects of varying length and speed provides signal interconnects
between logic array blocks (LABs), memory block structures, digital
signal processing (DSP) blocks, and input/output elements (IOE). These
blocks communicate with themselves and to one another through a fabric
of routing wires. This chapter provides details on the Stratix III core
routing structure. It also describes how Stratix III block types interface to
this fabric.
In the Stratix III architecture, connections between adaptive logic
modules (ALMs), TriMatrix memory, DSP blocks, and device I/O pins
are provided by the MultiTrack interconnect structure with DirectDrive
technology. The MultiTrack interconnect consists of continuous,
performance-optimized routing lines of different lengths and speeds
used for inter- and intra-design block connectivity. The Quartus
Compiler automatically routes critical design paths on faster
interconnects to improve design performance.
DirectDrive technology is a deterministic routing technology that ensures
identical routing resource usage for any function regardless of placement
in the device. The MultiTrack interconnect and DirectDrive technology
simplify the integration stage of block-based designing by eliminating the
re-optimization cycles that typically follow design changes and
additions.
The MultiTrack interconnect consists of row and column interconnects
that span fixed distances. A routing structure with fixed length resources
for all devices allows predictable and repeatable performance when
migrating through different device densities.
Dedicated row interconnects route signals to and from LABs, DSP blocks,
and TriMatrix memory blocks in the same row. These row interconnect
resources include:
Direct link interconnects between LABs and adjacent blocks
R4 interconnects traversing four blocks to the right or left
R20 row interconnects for high-speed access across the length of the
device
®
III devices contain a two-dimensional row- and column-based
3. MultiTrack Interconnect in
Stratix III Devices
®
II
3–1

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