ISP1507BBS,118 NXP Semiconductors, ISP1507BBS,118 Datasheet - Page 75

• Manufacturer Part Number: ISP1507BBS,118
• Description: RF Transceiver USB 2.0 ULPI TRNSCVR
• Manufacturer: NXP Semiconductors

Specifications of ISP1507BBS,118

• Number Of Transceivers: 1
• Esd Protection: YeskV
• Power Supply Requirement: Single
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Pin Count: 32
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Lead Free Status / RoHS Status: Compliant
• Other names: 935285495118 ISP1507BBS-T

NXP Semiconductors
ISP1507A_ISP1507B_1
Product data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 60.
Table 61.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 60
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
61
38.
Rev. 01 — 19 May 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
ISP1507A; ISP1507B
350 to 2000
260
250
245
38) than a SnPb process, thus
ULPI HS USB OTG transceiver
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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