K4T1G164QF-BCE6 Samsung Semiconductor, K4T1G164QF-BCE6 Datasheet - Page 3

• Manufacturer Part Number: K4T1G164QF-BCE6
• Manufacturer: Samsung Semiconductor

Specifications of K4T1G164QF-BCE6

• Lead Free Status / Rohs Status: Compliant

K4T1G044QF
K4T1G084QF
K4T1G164QF
Table Of Contents
1Gb F-die DDR2 SDRAM
1. Ordering Information ..................................................................................................................................................... 4
2. Key Features................................................................................................................................................................. 4
3. Package pinout/Mechanical Dimension & Addressing.................................................................................................. 5
4. Input/Output Functional Description.............................................................................................................................. 10
5. DDR2 SDRAM Addressing ........................................................................................................................................... 11
6. Absolute Maximum Ratings .......................................................................................................................................... 12
7. AC & DC Operating Conditions..................................................................................................................................... 12
8. ODT DC electrical characteristics ................................................................................................................................. 14
9. OCD default characteristics .......................................................................................................................................... 15
10. IDD Specification Parameters and Test Conditions .................................................................................................... 16
11. DDR2 SDRAM IDD Spec Table.................................................................................................................................. 18
12. Input/Output capacitance ............................................................................................................................................ 20
13. Electrical Characteristics & AC Timing for DDR2-800/667 ......................................................................................... 20
14. General notes, which may apply for all AC parameters .............................................................................................. 23
15. Specific Notes for dedicated AC parameters .............................................................................................................. 25
3.1 x4 Package Pinout (Top view) : 60ball FBGA Package .......................................................................................... 5
3.2 x8 Package Pinout (Top view) : 60ball FBGA Package .......................................................................................... 6
3.3 x16 Package Pinout (Top view) : 84ball FBGA Package ........................................................................................ 7
3.4 FBGA Package Dimension (x4/x8) .......................................................................................................................... 8
3.5 FBGA Package Dimension (x16)............................................................................................................................. 9
7.1 Recommended DC operating Conditions (SSTL_1.8)............................................................................................. 12
7.2 Operating Temperature Condition ........................................................................................................................... 13
7.3 Input DC Logic Level ............................................................................................................................................... 13
7.4 Input AC Logic Level ............................................................................................................................................... 13
7.5 AC Input Test Conditions......................................................................................................................................... 13
7.6 Differential input AC logic Level............................................................................................................................... 14
7.7 Differential AC output parameters ........................................................................................................................... 14
13.1 Refresh Parameters by Device Density................................................................................................................. 20
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ................................................................ 20
13.3 Timing Parameters by Speed Grade ..................................................................................................................... 21
datasheet
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DDR2 SDRAM
Rev. 1.11