K4T1G164QF-BCE6 Samsung Semiconductor, K4T1G164QF-BCE6 Datasheet - Page 5

• Manufacturer Part Number: K4T1G164QF-BCE6
• Manufacturer: Samsung Semiconductor

Specifications of K4T1G164QF-BCE6

• Lead Free Status / Rohs Status: Compliant

K4T1G044QF
K4T1G084QF
K4T1G164QF
3. Package pinout/Mechanical Dimension & Addressing
3.1 x4 Package Pinout (Top view) : 60ball FBGA Package
NOTE : V
DDL
and V
SSDL
A
B
C
D
E
G
H
K
F
J
L
are power and ground for the DLL. It is recommended that they be isolated on the device from V
Top view
(See the balls through package)
Ball Locations (x4)
Populated ball
Ball not populated
V
V
BA2
V
V
V
NC
NC
DDQ
DDL
1
DD
SS
DD
A10/AP
V
V
V
DQ1
CKE
BA0
A12
NC
A3
A7
SSQ
SSQ
REF
2
datasheet
V
DQ3
BA1
V
V
DM
WE
NC
A1
A5
A9
DDQ
3
SS
SS
4
- 5 -
G
5
A
B
C
D
E
F
H
K
J
L
6
1
2
V
V
V
DQS
RAS
CAS
DQ2
A11
SSDL
NC
A2
A6
SSQ
DDQ
3
7
4
5
V
V
DQS
DQ0
A13
6
CK
CK
CS
A0
A4
A8
SSQ
SSQ
8
7
8
ODT0
9
V
V
V
V
V
NC
NC
DDQ
DDQ
9
DD
DD
SS
DD
,V
DDQ
DDR2 SDRAM
, V
SS
, and V
SSQ
.
Rev. 1.11