K4T1G164QF-BCE6 Samsung Semiconductor, K4T1G164QF-BCE6 Datasheet - Page 9

• Manufacturer Part Number: K4T1G164QF-BCE6
• Manufacturer: Samsung Semiconductor

Specifications of K4T1G164QF-BCE6

• Lead Free Status / Rohs Status: Compliant

K4T1G044QF
K4T1G084QF
K4T1G164QF
3.5 FBGA Package Dimension (x16)
(Post reflow 0.50 ± 0.05)
84-∅0.48 Solder ball
0.2 M A B
(Datum A)
(Datum B)
#A1
G
M
A
B
C
D
E
F
H
K
N
P
R
J
L
9
8
0.80
datasheet
BOTTOM VIEW
7
0.80 x 8 = 6. 40
TOP VIEW
7.50 ± 0.10
7.50 ± 0.10
6
(0.60)
5
1.60
(0.30)
4
3.20
3
2
- 9 -
MOLDING AREA
1
A
# A1 INDEX MARK
B
Units : Millimeters
0.37±0.05
1.10±0.10
DDR2 SDRAM
Rev. 1.11