ADSP-2187LKSTZ-210 Analog Devices Inc, ADSP-2187LKSTZ-210 Datasheet - Page 2

• Manufacturer Part Number: ADSP-2187LKSTZ-210
• Description: IC DSP CONTRLR 16BIT 100-TQFP
• Manufacturer: Analog Devices Inc
• Series: ADSP-21xxr
• Type: Fixed Pointr

Specifications of ADSP-2187LKSTZ-210

• Interface: Host Interface, Serial Port
• Clock Rate: 52MHz
• Non-volatile Memory: External
• On-chip Ram: 160kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP, 100-VQFP
• Device Core Size: 16b
• Format: Fixed Point
• Clock Freq (max): 52.5MHz
• Mips: 52.5
• Device Input Clock Speed: 52.5MHz
• Ram Size: 160KB
• Program Memory Size: Not RequiredKB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADSP-2187LKSTZ210

ADSP-2184L/ADSP-2185L/ADSP-2186L/ADSP-2187L
TABLE OF CONTENTS
Performance Features ............................................... 1
Integration Features ................................................. 1
System Interface Features ........................................... 1
Table of Contents ..................................................... 2
Revision History ...................................................... 2
General Description ................................................. 3
Pin Descriptions .................................................... 17
REVISION HISTORY
1/08—Rev. C
This revision of the ADSP-2184L/ADSP-2185L/
ADSP-2186L/ADSP-2187L processor data sheet combines the
ADSP-2184L, ADSP-2185L, ADSP-2186L, and ADSP-2187L.
This version also contains new RoHS compliant packages.
Architecture Overview ........................................... 3
Modes Of Operation .............................................. 4
Interrupts ........................................................... 5
Low Power Operation ............................................ 6
System Interface ................................................... 7
Reset .................................................................. 8
Memory Architecture ............................................ 8
Bus Request and Bus Grant ................................... 13
Flag I/O Pins ..................................................... 13
Instruction Set Description ................................... 14
Development System ........................................... 14
Additional Information ........................................ 16
Memory Interface Pins ......................................... 18
Terminating Unused Pins ..................................... 19
Rev. C | Page 2 of 48 | January 2008
Specifications ........................................................ 21
Outline Dimensions ................................................ 46
Ordering Guide ..................................................... 47
Operating Conditions ........................................... 21
Electrical Characteristics ....................................... 21
Absolute Maximum Ratings ................................... 22
Package Information ............................................ 22
ESD Sensitivity ................................................... 22
Timing Specifications ........................................... 22
Power Supply Current .......................................... 36
Power Dissipation ............................................... 37
Output Drive Currents ......................................... 40
Power-Down Current ........................................... 41
Capacitive Loading – ADSP-2184L, ADSP-2186L ........ 42
Capacitive Loading – ADSP-2185L, ADSP-2187L ........ 42
Test Conditions .................................................. 43
Environmental Conditions .................................... 43
LQFP Package Pinout ........................................... 44
BGA Package Pinout ............................................ 45
Surface Mount Design .......................................... 47