ADSP-2187LKSTZ-210 Analog Devices Inc, ADSP-2187LKSTZ-210 Datasheet - Page 47

• Manufacturer Part Number: ADSP-2187LKSTZ-210
• Description: IC DSP CONTRLR 16BIT 100-TQFP
• Manufacturer: Analog Devices Inc
• Series: ADSP-21xxr
• Type: Fixed Pointr

Specifications of ADSP-2187LKSTZ-210

• Interface: Host Interface, Serial Port
• Clock Rate: 52MHz
• Non-volatile Memory: External
• On-chip Ram: 160kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP, 100-VQFP
• Device Core Size: 16b
• Format: Fixed Point
• Clock Freq (max): 52.5MHz
• Mips: 52.5
• Device Input Clock Speed: 52.5MHz
• Ram Size: 160KB
• Program Memory Size: Not RequiredKB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADSP-2187LKSTZ210

SURFACE MOUNT DESIGN
Table 31
BGA style surface mount packages. For industry-standard
design recommendations, refer to IPC-7351, Generic Require-
ments for Surface Mount Design and Land Pattern Standard.
Table 31. BGA Data for Use with Surface Mount Design
ORDERING GUIDE
1
2
3
Package
144-Ball BGA
(BC-144-6)
Model
ADSP-2184LBST-160
ADSP-2184LBSTZ-160
ADSP-2185LKST-115
ADSP-2185LKST-133
ADSP-2185LKST-160
ADSP-2185LKST-210
ADSP-2185LKSTZ-210
ADSP-2185LBST-115
ADSP-2185LBST-133
ADSP-2185LBSTZ-133
ADSP-2185LBST-160
ADSP-2185LBSTZ-160
ADSP-2185LBST-210
ADSP-2185LBSTZ-210
ADSP-2186LKST-115
ADSP-2186LKST-115R
ADSP-2186LKST-133
ADSP-2186LKSTZ-133
ADSP-2186LBST-115
ADSP-2186LBSTZ-115
ADSP-2186LBST-160
ADSP-2186LBCA-160R
ADSP-2187LKST-160
ADSP-2187LKSTZ-160
ADSP-2187LKST-210
ADSP-2187LKSTZ-210
ADSP-2187LBST-160
ADSP-2187LBSTZ-160
ADSP-2187LBST-210
ADSP-2187LBSTZ-210
Ranges shown represent ambient temperature.
Z = RoHS Compliant Part.
R = Tape and Reel.
is provided as an aid to PCB design to accommodate
2
3
2
2
2
2
2
2
2
2
2
2
2
3
Ball Attach Type
Solder Mask Defined
Temperature
Range
–40°C to +85°C
–40°C to +85°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1
ADSP-2184L/ADSP-2185L/ADSP-2186L/ADSP-2187L
Rev. C | Page 47 of 48 | January 2008
Solder Mask Opening
0.40 mm diameter
Instruction
Rate (MHz)
40
28.8
32.2
40
52.5
52.5
28.8
32.2
40
52.5
28.8
28.8
32.2
32.2
28.8
40
40
40
52.5
52.5
40
52.5
40
32.2
40
52.5
28.8
40
40
52.5
Package
Description
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
144-Ball BGA
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
100-Lead LQFP
Ball Pad Size
0.50 mm diameter
Package
Option
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
BC-144-6
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1
ST-100-1