CY7C68013A-128AXI Cypress Semiconductor Corp, CY7C68013A-128AXI Datasheet - Page 36

• Manufacturer Part Number: CY7C68013A-128AXI
• Description: IC MCU USB PERIPH HI SPD 128LQFP
• Manufacturer: Cypress Semiconductor Corp
• Series: EZ-USB FX2LP™r

Specifications of CY7C68013A-128AXI

• Program Memory Type: ROMless
• Package / Case: 128-LQFP
• Applications: USB Microcontroller
• Core Processor: 8051
• Controller Series: CY7C680xx
• Ram Size: 16K x 8
• Interface: I²C, USB, USART
• Number Of I /o: 40
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Processor Series: CY7C68xx
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, USART, USB
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 40
• Number Of Timers: 3
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: CY3684
• Minimum Operating Temperature: - 40 C
• Controller Family/series: (8051) USB
• Core Size: 8 Bit
• No. Of I/o's: 40
• Program Memory Size: 16KB
• Cpu Speed: 48MHz
• No. Of Timers: 3
• Embedded Interface Type: I2C, USART, USB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: CY4611B - KIT USB TO ATA REFERENCE DESIGN428-1677 - KIT DEVELOPMENT EZ-USB FX2LP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 428-1943; CY7C68013A-128AXI

6. Absolute Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ......................................–65°C to +150°C
Ambient Temperature with
Power Supplied (Commercial)...............................0°C to +70°C
Ambient Temperature with
Power Supplied (Industrial) ............................–40°C to + 105°C
Supply Voltage to Ground Potential.................... –0.5V to +4.0V
DC Input Voltage to Any Input Pin
DC Voltage Applied to Outputs
in High Z State .......................................... –0.5V to VCC + 0.5V
Power Dissipation..........................................................300 mW
Static Discharge Voltage................. ...............................>2000V
8. Thermal Characteristics
The following table displays the thermal characteristics of various packages:
Table 13. Thermal Characteristics
The Junction Temperature
where,
P = Power
θ
θ
The Case Temperature
where,
P = Power
θ
θ
Document #: 38-08032 Rev. *M
Package
56 SSOP
100 TQFP
128 TQFP
56 QFN
56 VFBGA
Note
15. Do not power I/O with chip power off.
Ja = Junction to Ambient Temperature (
a = Ambient Temperature (70 C)
Ca = Case to Ambient Temperature
a = Ambient Temperature (70 C)
Ambient Temperature
θ
c, can be calculated using the following equation:
(°C)
θ
θ
70
70
70
70
70
j, can be calculated using the following equation:
a
[15]
................................5.25V
θ
Junction to Case
Jc +
Temperature
θ
(°C/W)
Ca)
θ
24.4
11.9
15.5
10.6
30.9
Jc
Case to Ambient
Temperature
Max Output Current, per I/O port......................................10 mA
Max Output Current, all five I/O ports
(128- and 100-pin packages)............................................50 mA
7. Operating Conditions
T
Commercial ...........................................................0°C to +70°C
Industrial–40°C to +105°C
Supply Voltage................................................ +3.00V to +3.60V
Ground Voltage.......................................................................0V
F
T
A
OSC
(°C/W)
A
θ
23.3
34.0
27.7
14.6
27.7
(Ambient Temperature Under Bias)
(Ambient Temperature Under Bias)
Ca
(Oscillator or Crystal Frequency)............24 MHz ± 10 ppm,
θ
c = P*
θ
j = P*
θ
Ca +
θ
CY7C68013A, CY7C68014A
CY7C68015A, CY7C68016A
Ja +
Junction to Ambient Temperature
θ
a
θ
a
θ
Jc +
(°C/W)
47.7
45.9
43.2
25.2
58.6
θ
Ja
θ
Ca
Page 36 of 62
Parallel Resonant
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