LPC2361_62 NXP Semiconductors, LPC2361_62 Datasheet - Page 35

• Manufacturer Part Number: LPC2361_62
• Description: The LPC2361/2362 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 128 kB of embedded high-speed flash memory
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC2361_62
Product data sheet
Symbol
T
DD
j(max)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 6.
V
T
LQFP100
ja
JEDEC (4.5 in  4 in)
0 m/s
1 m/s
2.5 m/s
Single-layer (4.5 in  3 in)
0 m/s
1 m/s
2.5 m/s
jc
jb
DD
= 40 C to +85 C unless otherwise specified;
•
•
•
j
=
T
R
P
= 3.0 V to 3.6 V; T
amb
D
T
th(j-a)
amb
= sum of internal and I/O power dissipation
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)
Thermal resistance value (C/W): ±15 %

P
D
All information provided in this document is subject to legal disclaimers.
Conditions

R
th j a
amb

Rev. 5 — 25 October 2011
–
=



40

C to +85

C unless otherwise specified.
j
(C), can be calculated using the following
37.3
32.2
29.5
54.4
42.9
38.8
6.7
12
Min
-
DD
and V
DD
Single-chip 16-bit/32-bit MCU
Typ
-
. The I/O power dissipation of
LPC2361/62
Max
125
© NXP B.V. 2011. All rights reserved.
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C
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