LPC2361_62 NXP Semiconductors, LPC2361_62 Datasheet - Page 59

The LPC2361/2362 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 128 kB of embedded high-speed flash memory

LPC2361_62

Manufacturer Part Number
LPC2361_62
Description
The LPC2361/2362 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 128 kB of embedded high-speed flash memory
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
17. Revision history
Table 19.
LPC2361_62
Product data sheet
Document ID
LPC2361_62 v.5
Modifications:
LPC2361_62 v.4
Modifications:
Revision history
Release date
20111025
20100304
Table
– Updated description for USB_UP_LED.
– Added
– Added
– Added
Table
– Added “non-operating” to conditions column of T
– Updated storage temperature minimum/maximum to 65/+150.
– Updated
Table
Table
Section
Section
Added:
Table 3 “Pin description”: Added table note for XTAL1 and XTAL2 pins.
Table 4 “Limiting values”: Changed V
Table 5 “Static characteristics”: Updated min, typical and max values for oscillator pins.
Table 5 “Static characteristics”: Added table note for Z
Table 5 “Static characteristics”: Updated conditions and typical values for
I
Table 6 “Dynamic characteristics”: Added ARM processor clock frequency information.
Added Table 8 “Dynamic characteristics of flash”.
Added Table 10 “DAC electrical characteristics”.
Section 7.2 “On-chip flash programming memory”: Removed text regarding flash
endurance minimum specs.
Added Section 7.23.4.4 “Deep power-down mode”.
Section 7.24.2 “Brownout detection”: Changed V
Added Section 9.1 “Power-down mode”.
Added Section 9.2 “Deep power-down mode”.
Added Section 13.2 “XTAL1 input”.
Added Section 13.3 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines”.
Figure 13 “ADC characteristics”: Changed V
DD(DCDC)dpd(3V3)
Section 9 “Thermal
Section 10.3 “Electrical pin
Section 11.1 “Internal
Section 11.2 “I/O
Section 14.3 “RTC 32 kHz oscillator component selection”
Section 14.5 “Standard I/O pin configuration”
Section 14.6 “Reset pin
All information provided in this document is subject to legal disclaimers.
3:
4:
7: Changed V
12: Updated table.
14.2: Changed section title and updated contents.
14.4: Changed section title.
Table note 7
Table note 8
Table note 12
Rev. 5 — 25 October 2011
Table note
, I
Data sheet status
Product data sheet
Product data sheet
BATact
hys
pins”.
characteristics”.
typical value from 0.5V
, and I
for TCK and TDO pins.
for TMS, TDI, TRST, and RTCK pins.
5.
for RTCX1 and RTCX2 pins.
oscillators”.
configuration”.
BAT
characteristics”.
.
ESD
min/max to 2500/+2500.
DDA
Change notice
-
-
DD(3V3)
to V
DD(3V3)
stg
Single-chip 16-bit/32-bit MCU
i(VREF)
to 0.05V
DRV
.
to V
.
.
LPC2361/62
DD(DCDC)(3V3)
DD(3V3)
Supersedes
LPC2361_62 v.4
LPC2361_62 v.3
© NXP B.V. 2011. All rights reserved.
.
.
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