LPC2367FBD100 NXP Semiconductors, LPC2367FBD100 Datasheet - Page 40

• Manufacturer Part Number: LPC2367FBD100
• Description: The LPC2367FBD100 is a ARM7 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 72 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Thermal characteristics
Table 6.
V
Table 7.
V
LPC2364_65_66_67_68
Product data sheet
Symbol
T
LQFP100
ja
JEDEC (4.5 in  4 in)
0 m/s
1 m/s
2.5 m/s
Single-layer (4.5 in  3 in)
0 m/s
1 m/s
2.5 m/s
jc
jb
DD
DD
j(max)
= 3.0 V to 3.6 V; T
= 3.0 V to 3.6 V; T
Thermal characteristics
Thermal resistance value (C/W): ±15 %
Parameter
maximum junction
temperature
amb
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
= 40 C to +85 C unless otherwise specified;
=
•
•
•
j

=
T
R
P
40
amb
D
T
th(j-a)
37.3
32.2
29.5
54.4
42.9
38.8
6.7
12
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)

P
D
All information provided in this document is subject to legal disclaimers.

Conditions

C unless otherwise specified;
R
th j a

Rev. 7 — 20 October 2011
–


TFBGA100
ja
JEDEC (4.5 in  4 in)
0 m/s
1 m/s
2.5 m/s
8-layer (4.5 in  3 in)
0 m/s
1 m/s
2.5 m/s
jc
jb
j
(C), can be calculated using the following
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
Min
-
DD
and V
DD
Typ
-
. The I/O power dissipation of
53.9
45.5
39.5
44.3
39.2
34.2
9.4
10.8
Max
125
© NXP B.V. 2011. All rights reserved.
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