K9F5608D0D SAMSUNG [Samsung semiconductor], K9F5608D0D Datasheet - Page 33

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K9F5608D0D

Manufacturer Part Number
K9F5608D0D
Description
32M x 8 Bit NAND Flash Memory
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
READY/BUSY
The device has a R/B output that provides a hardware method of indicating the completion of a page program, erase and random
read completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command reg-
ister or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin
is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up resistor value is related to tr(R/B)
and current drain during busy(ibusy) , an appropriate value can be obtained with the following reference chart(Fig 15). Its value can
be determined by the following guidance.
K9F5608R0D
K9F5608U0D
V
CC
GND
K9F5608D0D
Device
open drain output
R/B
Rp
ibusy
Figure 15. Rp vs tr ,tf & Rp vs ibusy
C
L
Ready Vcc
33
tf
1.8V device - V
2.65V device - V
3.3V device - V
VOL
OL
OL
OL
Busy
: 0.1V, V
: 0.4V, V
: 0.4V, V
FLASH MEMORY
OH
OH
OH
: Vcc
: 2.4V
: Vcc
Q
-0.1V
Q
tr
-0.4V
VOH

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