K9F5608D0D SAMSUNG [Samsung semiconductor], K9F5608D0D Datasheet - Page 5

no-image

K9F5608D0D

Manufacturer Part Number
K9F5608D0D
Description
32M x 8 Bit NAND Flash Memory
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
PACKAGE DIMENSIONS
PIN CONFIGURATION (FBGA)
K9F5608R0D
K9F5608U0D
63-Ball FBGA (measured in millimeters)
#A1
Top View
9.00
K9F5608D0D
±0.10
A
B
C
D
E
G
H
F
N.C N.C
N.C
N.C N.C
N.C
N.C
K9F5608X0D-JCB0/JIB0
/WP
Vss
NC
NC
NC
NC
NC
NC
1
63-∅0.45
(Datum B)
(Datum A)
I/O0
2
ALE
I/O1
I/O2
/RE
NC
NC
NC
0.10MAX
0.20
Top View
NC
CLE
NC VccQ I/O5
I/O3
3
Vss
NC
NC
NC
M
±0.05
5
I/O4
/CE
A B
NC
NC
NC
NC
NC
4
A
B
C
D
E
G
H
F
/WE
I/O6
NC
NC
NC
NC
NC
5
R/B
NC
I/O7
Vss
NC
NC
NC
Vcc
6
N.C N.C
N.C
N.C N.C
N.C
6
N.C
N.C
0.80 x 5= 4.00
2.00
2.00
0.80 x 9= 7.20
5
Bottom View
0.80
Side View
9.00
9.00
4
±0.10
±0.10
3
FLASH MEMORY
2
0.45
1
±0.05
A
B

Related parts for K9F5608D0D