K9F5608D0D SAMSUNG [Samsung semiconductor], K9F5608D0D Datasheet - Page 4

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K9F5608D0D

Manufacturer Part Number
K9F5608D0D
Description
32M x 8 Bit NAND Flash Memory
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
PIN CONFIGURATION (TSOP1)
PACKAGE DIMENSIONS
K9F5608R0D
48-PIN LEAD/LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
K9F5608U0D
48 - TSOP1 - 1220F
0~8°
0.018~0.030
0.45~0.75
#1
#24
K9F5608D0D
CLE
ALE
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
R/B
Vcc
Vss
WE
WP
RE
CE
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
0.787
20.00
K9F5608D(U)0D-PCB0/PIB0
0.724
18.40
±0.008
±0.20
±0.004
±0.10
4
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
#48
#25
(
0.020
0.50
N.C
N.C
N.C
N.C
I/O7
I/O6
I/O5
I/O4
N.C
N.C
N.C
Vcc
Vss
N.C
N.C
N.C
I/O3
I/O2
I/O1
I/O0
N.C
N.C
N.C
N.C
)
FLASH MEMORY
0.039
1.00
0.047
1.20
±0.05
±0.002
MAX
Unit :mm/Inch
0.002
0.05
MIN

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