MT46H16M32LFCX-5:B Micron Technology Inc, MT46H16M32LFCX-5:B Datasheet - Page 15

• Manufacturer Part Number: MT46H16M32LFCX-5:B
• Description: IC DDR SDRAM 512MBIT 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H16M32LFCX-5:B

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 90-VFBGA
• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 200MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 125mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Dimensions
Figure 6: 60-Ball VFBGA (8mm x 9mm)
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls are
Ø0.42 on Ø0.4 SMD
ball pads.
Seating
plane
60x Ø0.45
7.2
0.1 A
0.8 TYP
0.8 TYP
3.6
Note:
A
9
8
1. All dimensions are in millimeters.
7
8 ±0.1
6.4
3.2
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
4.5 ±0.05
0.65 ±0.05
15
Ball A1 ID
0.3 ±0.025
512Mb: x16, x32 Mobile LPDDR SDRAM
9 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
© 2004 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID