MT46H16M32LFCX-5:B Micron Technology Inc, MT46H16M32LFCX-5:B Datasheet - Page 48

IC DDR SDRAM 512MBIT 90VFBGA

MT46H16M32LFCX-5:B

Manufacturer Part Number
MT46H16M32LFCX-5:B
Description
IC DDR SDRAM 512MBIT 90VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet

Specifications of MT46H16M32LFCX-5:B

Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
512M (16M x 32)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
90-VFBGA
Organization
16Mx32
Density
512Mb
Address Bus
15b
Access Time (max)
6.5/5ns
Maximum Clock Rate
200MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
125mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT46H16M32LFCX-5:B
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H16M32LFCX-5:B
Manufacturer:
MICRON
Quantity:
20 000
Part Number:
MT46H16M32LFCX-5:B TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Initialization
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Prior to normal operation, the device must be powered up and initialized in a prede-
fined manner. Using initialization procedures other than those specified will result in
undefined operation.
If there is an interruption to the device power, the device must be re-initialized using
the initialization sequence described below to ensure proper functionality of the device.
To properly initialize the device, this sequence must be followed:
After steps 1–10 are completed, the device has been properly initialized and is ready to
receive any valid command.
10. Issue NOP or DESELECT commands for at least
1. The core power (V
2. When power supply voltages are stable and the CKE has been driven HIGH, it is
3. When the clock is stable, a 200μs minimum delay is required by the Mobile
4. Issue a PRECHARGE ALL command.
5. Issue NOP or DESELECT commands for at least
6. Issue an AUTO REFRESH command followed by NOP or DESELECT commands
7. Using the LOAD MODE REGISTER command, load the standard mode register as
8. Issue NOP or DESELECT commands for at least
9. Using the LOAD MODE REGISTER command, load the extended mode register to
It is recommended that V
must never exceed V
HIGH (see Figure 16 (page 49)). Alternatively, initialization can be completed
with CKE LOW provided that CKE transitions HIGH
(page 50)).
safe to apply the clock.
LPDDR prior to applying an executable command. During this time, NOP or DESE-
LECT commands must be issued on the command bus.
for at least
or DESELECT commands for at least
must be issued. Typically, both of these commands are issued at this stage as de-
scribed above.
desired.
the desired operating modes. Note that the sequence in which the standard and
extended mode registers are programmed is not critical.
t
RFC time. Issue a second AUTO REFRESH command followed by NOP
DD
DD
) and I/O power (V
. Standard initialization requires that CKE be asserted
48
DD
and V
512Mb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
DDQ
t
RFC time. Two AUTO REFRESH commands
be from the same power source, or V
DDQ
) must be brought up simultaneously.
t
t
t
RP time.
MRD time.
MRD time.
t
IS prior to T0 (see Figure 17
© 2004 Micron Technology, Inc. All rights reserved.
Initialization
DDQ

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