OM11043 NXP Semiconductors, OM11043 Datasheet - Page 43

• Manufacturer Part Number: OM11043
• Description: DEVELOPMENT BOARD LPC1768 MBED
• Manufacturer: NXP Semiconductors
• Series: mbedr
• Type: MCUr

Specifications of OM11043

• Contents: Board and software
• Development Tool Type: Hardware / Software - Eval/Demo Board
• Kit Contents: Board Cable Docs
• Mcu Supported Families: LPC1000
• Tool / Board Applications: General Purpose MCU, MPU, DSP, DSC
• Silicon Manufacturer: NXP
• Core Architecture: ARM
• Core Sub-architecture: Cortex - M3
• Silicon Core Number: LPC17xx
• Silicon Family Name: LPC17xx
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: LPC1768
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4916

NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC1769_68_67_66_65_64_63
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
−
=
T
R
P
40
amb
D
T
th(j-a)
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
+
= the package junction-to-ambient thermal resistance (°C/W)
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 6.01 — 11 March 2011
–
)
)
LPC1769/68/67/66/65/64/63
j
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
°C
43 of 79
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