OM11043 NXP Semiconductors, OM11043 Datasheet - Page 73

• Manufacturer Part Number: OM11043
• Description: DEVELOPMENT BOARD LPC1768 MBED
• Manufacturer: NXP Semiconductors
• Series: mbedr
• Type: MCUr

Specifications of OM11043

• Contents: Board and software
• Development Tool Type: Hardware / Software - Eval/Demo Board
• Kit Contents: Board Cable Docs
• Mcu Supported Families: LPC1000
• Tool / Board Applications: General Purpose MCU, MPU, DSP, DSC
• Silicon Manufacturer: NXP
• Core Architecture: ARM
• Core Sub-architecture: Cortex - M3
• Silicon Core Number: LPC17xx
• Silicon Family Name: LPC17xx
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: LPC1768
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4916

NXP Semiconductors
Fig 38. Package outline SOT926-1 (TFBGA100)
LPC1769_68_67_66_65_64_63
Product data sheet
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
SOT926-1
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
G
K
H
E
D
C
B
A
F
J
0.65
0.8
A
2
1
IEC
- - -
2
0.5
0.4
b
e
3
9.1
8.9
4
D
5
e
D
1
9.1
8.9
JEDEC
6
E
All information provided in this document is subject to legal disclaimers.
- - -
1/2 e
7
REFERENCES
0.8
8
e
b
Rev. 6.01 — 11 March 2011
9
0
7.2
e
10
1
JEITA
7.2
e
- - -
2
1/2 e
scale
B
2.5
e
LPC1769/68/67/66/65/64/63
∅ v
∅ w
0.15
v
M
M
e
A
E
2
C
C
0.05
A
w
5 mm
A
B
0.08
A
y
1
32-bit ARM Cortex-M3 microcontroller
A
2
0.1
y
1
y
1
C
detail X
PROJECTION
EUROPEAN
X
C
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
05-12-09
05-12-22
SOT926-1
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