MC68HC908JL8CSPE Freescale Semiconductor, MC68HC908JL8CSPE Datasheet - Page 196

• Manufacturer Part Number: MC68HC908JL8CSPE
• Description: IC MCU 8K FLASH 8MHZ 32-DIP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC68HC908JL8CSPE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LED, LVD, POR, PWM
• Number Of I /o: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 13x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-SDIP (0.400", 10.16mm)
• Controller Family/series: HC08
• No. Of I/o's: 26
• Ram Memory Size: 256Byte
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08JL
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 26
• Number Of Timers: 4
• Operating Supply Voltage: 0 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Development Tools By Supplier: FSICEBASE, DEMO908JL16E, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 13 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
18.3 20-Pin Small Outline Integrated Circuit Package (SOIC)
18.4 28-Pin Plastic Dual In-Line Package (PDIP)
196
20
1
H
28
1
20X
G
18X
0.010 (0.25)
MC68HC908JL8/JK8 • MC68HC08JL8/JK8 • MC68HC908KL8 Data Sheet, Rev. 3.1
–A–
D
G
F
A
M
T
A
10
11
–B–
S
Figure 18-2. 20-Pin SOIC (Case #751D)
D
K
Figure 18-3. 28-Pin PDIP (Case #710)
14
C
15
B
S
SEATING
PLANE
10X
N
–T–
B
P
K
0.010 (0.25)
SEATING
PLANE
C
J
F
M
M
B
M
L
M
J
R
X 45
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
FORMED PARALLEL.
DIM
G
M
A
B
C
D
F
H
J
K
L
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.150
5. DIMENSION D DOES NOT INCLUDE
36.45
13.72
MILLIMETERS
MIN
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
(0.006) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
3.94
0.36
1.02
1.65
0.20
2.92
0.51
15.24 BSC
DIM
2.54 BSC
0°
A
B
C
D
G
K
M
R
F
J
P
37.21
14.22
12.65
10.05
MAX
MILLIMETERS
MIN
5.08
0.56
1.52
2.16
0.38
3.43
1.02
7.40
2.35
0.35
0.50
0.25
0.10
0.25
15°
1.27 BSC
0
Freescale Semiconductor
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.020
0.115
12.95
10.55
MAX
MIN
7.60
2.65
0.49
0.90
0.32
0.25
0.75
0.600 BSC
0°
7
0.100 BSC
INCHES
MAX
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
0.499
0.292
0.093
0.014
0.020
0.010
0.004
0.395
0.010
15°
MIN
0.050 BSC
0
INCHES
0.510
0.299
0.104
0.019
0.035
0.012
0.009
0.415
0.029
MAX
7