MC9S08AW60CPUE Freescale Semiconductor, MC9S08AW60CPUE Datasheet - Page 117

IC MCU 64K FLASH 64-LQFP

MC9S08AW60CPUE

Manufacturer Part Number
MC9S08AW60CPUE
Description
IC MCU 64K FLASH 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08AW60CPUE

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08AW
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
54
Number Of Timers
8
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AW60E
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
For Use With
DEMO9S08AW60E - DEMO BOARD FOR MC9S08AW60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Chapter 7 Central Processor Unit (S08CPUV2)
7.4.5
BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active background
mode rather than continuing the user program.
MC9S08AW60 Data Sheet, Rev 2
Freescale Semiconductor
117

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