MC9S08AW60CPUE Freescale Semiconductor, MC9S08AW60CPUE Datasheet - Page 17

• Manufacturer Part Number: MC9S08AW60CPUE
• Description: IC MCU 64K FLASH 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AW60CPUE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: S08AW
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 8
• Operating Supply Voltage: - 0.3 V to + 5.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08AW60E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• For Use With: DEMO9S08AW60E - DEMO BOARD FOR MC9S08AW60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Section Number
15.1 Introduction ...................................................................................................................................261
15.2 Background Debug Controller (BDC) ..........................................................................................262
15.3 On-Chip Debug System (DBG) ....................................................................................................271
15.4 Register Definition ........................................................................................................................275
A.1 Introduction ....................................................................................................................................283
A.2 Parameter Classification.................................................................................................................283
A.3 Absolute Maximum Ratings...........................................................................................................283
A.4 Thermal Characteristics..................................................................................................................285
A.5 ESD Protection and Latch-Up Immunity .......................................................................................286
A.6 DC Characteristics..........................................................................................................................287
A.7 Supply Current Characteristics.......................................................................................................291
A.8 ADC Characteristics.......................................................................................................................293
A.9 Internal Clock Generation Module Characteristics ........................................................................296
A.10 AC Characteristics..........................................................................................................................300
A.11 SPI Characteristics .........................................................................................................................303
A.12 FLASH Specifications....................................................................................................................306
A.13 EMC Performance..........................................................................................................................307
Freescale Semiconductor
15.1.1
15.2.1
15.2.2
15.2.3
15.2.4
15.3.1
15.3.2
15.3.3
15.3.4
15.3.5
15.3.6
15.4.1
15.4.2
15.4.3
A.9.1
A.10.1 Control Timing ..............................................................................................................300
A.10.2 Timer/PWM (TPM) Module Timing.............................................................................302
A.13.1 Radiated Emissions .......................................................................................................307
A.13.2 Conducted Transient Susceptibility...............................................................................307
Features .........................................................................................................................262
BKGD Pin Description .................................................................................................263
Communication Details ................................................................................................264
BDC Commands ...........................................................................................................268
BDC Hardware Breakpoint ..........................................................................................270
Comparators A and B ...................................................................................................271
Bus Capture Information and FIFO Operation .............................................................271
Change-of-Flow Information ........................................................................................272
Tag vs. Force Breakpoints and Triggers .......................................................................272
Trigger Modes ..............................................................................................................273
Hardware Breakpoints ..................................................................................................275
BDC Registers and Control Bits ...................................................................................275
System Background Debug Force Reset Register (SBDFR) ........................................277
DBG Registers and Control Bits ..................................................................................278
ICG Frequency Specifications.......................................................................................297
Electrical Characteristics and Timing Specifications
Development Support
MC9S08AW60 Data Sheet, Rev 2
Appendix A
Chapter 15
Title
Page
17