MC9S08AW60CPUE Freescale Semiconductor, MC9S08AW60CPUE Datasheet - Page 289
MC9S08AW60CPUE
Manufacturer Part Number
MC9S08AW60CPUE
Description
IC MCU 64K FLASH 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08AW32CFDE.pdf
(324 pages)
Specifications of MC9S08AW60CPUE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08AW
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
54
Number Of Timers
8
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AW60E
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
For Use With
DEMO9S08AW60E - DEMO BOARD FOR MC9S08AW60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
8
0.2 1.2
IRQ does not have a clamp diode to V
0.2
Figure A-2. Typical Low-Side Driver (Sink) Characteristics — High Drive (PTxDS
Figure A-1. Typical Low-Side Driver (Sink) Characteristics — Low Drive (PTxDS
0.6
125ºC
1.6
85ºC
25ºC
40ºC
125ºC
85ºC
25ºC
40ºC
2.0
1.2
3.0
I
OL
I
4.0
OL
1.6
(mA)
(mA)
5.0
6.0
2.0
7.0
MC9S08AW60 Data Sheet, Rev 2
V
2.4
V
DD
8.0 9.0
DD
DD
= 5V
. Do not drive IRQ above V
= 5V
3.0
10.0
Appendix A Electrical Characteristics and Timing Specifications
0.8
0.7
0.6
0.5
0.4
0.3
0.2
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
2.75 3.0
DD
3.0
.
3.25
3.5
3.75
4.0
I
V
V
OL
I
DD
DD
OL
4.0
= 2mA
4.25
(V)
(V)
= +10mA
4.5
4.75
n
n
= 0)
= 1)
5.0 5.25
5.0
125ºC
85ºC
25ºC
40ºC
125ºC
85ºC
25ºC
40ºC
5.5
289
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