MC9S08AW60CPUE Freescale Semiconductor, MC9S08AW60CPUE Datasheet - Page 264

IC MCU 64K FLASH 64-LQFP

MC9S08AW60CPUE

Manufacturer Part Number
MC9S08AW60CPUE
Description
IC MCU 64K FLASH 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08AW60CPUE

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08AW
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
54
Number Of Timers
8
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AW60E
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
For Use With
DEMO9S08AW60E - DEMO BOARD FOR MC9S08AW60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08AW60CPUE
Manufacturer:
TDK-LAMBDA
Quantity:
92
Part Number:
MC9S08AW60CPUE
Manufacturer:
FREESCALE
Quantity:
4 000
Part Number:
MC9S08AW60CPUE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S08AW60CPUE
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC9S08AW60CPUE
Quantity:
7
Part Number:
MC9S08AW60CPUE
Quantity:
7
Part Number:
MC9S08AW60CPUE
0
Part Number:
MC9S08AW60CPUER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Chapter 15 Development Support
When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD
chooses normal operating mode. When a debug pod is connected to BKGD it is possible to force the MCU
into active background mode after reset. The specific conditions for forcing active background depend
upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not
necessary to reset the target MCU to communicate with it through the background debug interface.
15.2.2
Communication Details
The BDC serial interface requires the external controller to generate a falling edge on the BKGD pin to
indicate the start of each bit time. The external controller provides this falling edge whether data is
transmitted or received.
BKGD is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data
is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if
512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress
when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU
system.
The custom serial protocol requires the debug pod to know the target BDC communication clock speed.
The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the
BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source.
The BKGD pin can receive a high or low level or transmit a high or low level. The following diagrams
show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but
asynchronous to the external host. The internal BDC clock signal is shown for reference in counting cycles.
MC9S08AW60 Data Sheet, Rev 2
264
Freescale Semiconductor

Related parts for MC9S08AW60CPUE