D6417729RHF200BV Renesas Electronics America, D6417729RHF200BV Datasheet - Page 37

IC SUPER H MPU ROMLESS 208QFP

D6417729RHF200BV

Manufacturer Part Number
D6417729RHF200BV
Description
IC SUPER H MPU ROMLESS 208QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of D6417729RHF200BV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.85 V ~ 2.15 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D6417729RHF200BV
Manufacturer:
EVERLIGHT
Quantity:
1 000
Part Number:
D6417729RHF200BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Figure 11.16 Basic Timing for Synchronous DRAM Single Read............................................ 328
Figure 11.17 Basic Timing for Synchronous DRAM Burst Write ............................................ 330
Figure 11.18 Basic Timing for Synchronous DRAM Single Write........................................... 332
Figure 11.19 Burst Read Timing (No Precharge) ...................................................................... 335
Figure 11.20 Burst Read Timing (Same Row Address) ............................................................ 336
Figure 11.21 Burst Read Timing (Different Row Addresses) ................................................... 337
Figure 11.22 Burst Write Timing (No Precharge) ..................................................................... 338
Figure 11.23 Burst Write Timing (Same Row Address) ........................................................... 339
Figure 11.24 Burst Write Timing (Different Row Addresses) .................................................. 340
Figure 11.25 Auto-Refresh Operation ....................................................................................... 341
Figure 11.26 Synchronous DRAM Auto-Refresh Timing......................................................... 342
Figure 11.27 Synchronous DRAM Self-Refresh Timing .......................................................... 344
Figure 11.28 Synchronous DRAM Mode Write Timing ........................................................... 346
Figure 11.29 Burst ROM Wait Access Timing ......................................................................... 348
Figure 11.30 Burst ROM Basic Access Timing ........................................................................ 349
Figure 11.31 Example of PCMCIA Interface ............................................................................ 351
Figure 11.32 Basic Timing for PCMCIA Memory Card Interface ............................................ 353
Figure 11.33 Wait Timing for PCMCIA Memory Card Interface ............................................. 354
Figure 11.34 Basic Timing for PCMCIA Memory Card Interface Burst Access ...................... 355
Figure 11.35 Wait Timing for PCMCIA Memory Card Interface Burst Access ....................... 356
Figure 11.36 PCMCIA Space Allocation .................................................................................. 357
Figure 11.37 Basic Timing for PCMCIA I/O Card Interface .................................................... 359
Figure 11.38 Wait Timing for PCMCIA I/O Card Interface ..................................................... 360
Figure 11.39 Dynamic Bus Sizing Timing for PCMCIA I/O Card Interface ............................ 361
Figure 11.40 Waits between Access Cycles .............................................................................. 363
Figure 11.41 Pull-Up Timing for Pins A25 to A0 ..................................................................... 364
Figure 11.42 Pull-Up Timing for Pins D31 to D0 (Read Cycle) ............................................... 365
Figure 11.43 Pull-Up Timing for Pins D31 to D0 (Write Cycle) .............................................. 365
Figure 12.1
Figure 12.2
Figure 12.3
Figure 12.4
Figure 12.5
Figure 12.6
Figure 12.7
Figure 12.8
Figure 12.9
Block Diagram of DMAC .................................................................................... 371
DMAC Transfer Flowchart .................................................................................. 388
Round-Robin Mode.............................................................................................. 392
Changes in Channel Priority in Round-Robin Mode............................................ 393
Operation of Direct Address Mode in Dual Address Mode ................................. 395
Example of DMA Transfer Timing in the Direct Address Mode in Dual Mode
(Transfer Source: Ordinary Memory, Transfer Destination: Ordinary Memory). 396
Example of DMA Transfer Timing in the Direct Address Mode in Dual Mode
(16-byte Transfer, Transfer Source: Ordinary Memory,
Transfer Destination: Ordinary Memory)............................................................. 397
Example of DMA Transfer Timing in the Direct Address Mode in Dual Mode
(16-byte Transfer, Transfer Source: Synchronous DRAM,
Transfer Destination: Ordinary Memory)............................................................. 397
Indirect Address Operation in Dual Address Mode (When External Memory
Space has a 16-Bit Width).................................................................................... 399
Rev. 5.0, 09/03, page xxxv of xlvi

Related parts for D6417729RHF200BV