AT32UC3B0512-A2UT Atmel, AT32UC3B0512-A2UT Datasheet - Page 637

• Manufacturer Part Number: AT32UC3B0512-A2UT
• Description: IC MCU AVR32 512K FLASH 64TQFP
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3B0512-A2UT

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 44
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Controller Family/series: AT32UC3B
• No. Of I/o's: 44
• Ram Memory Size: 96KB
• Cpu Speed: 60MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

29. Mechanical Characteristics
29.1
29.1.1
29.1.2
32059K–03/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 29-1
Table 29-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
page
Table 29-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
637.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
637.
JA
)
624.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
AT32UC3B
Table 29-1 on
49.6
13.5
51.1
13.7
Typ
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
637