ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 346

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

21.5.3.2
21.5.4
346
SAM3S Preliminary
In Application Programming (IAP) Feature
Communication Endpoints
There are two communication endpoints and endpoint 0 is used for the enumeration process.
Endpoint 1 is a 64-byte Bulk OUT endpoint and endpoint 2 is a 64-byte Bulk IN endpoint. SAM-
BA Boot commands are sent by the host through endpoint 1. If required, the message is split by
the host into several data payloads by the host driver.
If the command requires a response, the host can send IN transactions to pick up the response.
The IAP feature is a function located in ROM that can be called by any software application.
When called, this function sends the desired FLASH command to the EEFC and waits for the
Flash to be ready (looping while the FRDY bit is not set in the MC_FSR register).
Since this function is executed from ROM, this allows Flash programming (such as sector write)
to be done by code running in Flash.
The IAP function entry point is retrieved by reading the NMI vector in ROM (0x00800008).
This function takes one argument in parameter: the command to be sent to the EEFC.
This function returns the value of the MC_FSR register.
IAP software code example:
(unsigned int) (*IAP_Function)(unsigned long);
void main (void){
/* Initialize the function pointer (retrieve function address from NMI
vector) */
/* Send your data to the sector here */
/* build the command to send to EEFC */
/* Call the IAP function with appropriate command */
}
unsigned long FlashSectorNum = 200; //
unsigned long flash_cmd = 0;
unsigned long flash_status = 0;
unsigned long EFCIndex = 0; // 0:EEFC0, 1: EEFC1
IAP_Function = ((unsigned long) (*)(unsigned long)) 0x00800008;
flash_cmd =
flash_status = IAP_Function (EFCIndex, flash_cmd);
(0x5A << 24) | (FlashSectorNum << 8) | AT91C_MC_FCMD_EWP;
6500C–ATARM–8-Feb-11