ATSAM3S4CA-AU Atmel, ATSAM3S4CA-AU Datasheet - Page 366

• Manufacturer Part Number: ATSAM3S4CA-AU
• Description: IC MCU 32BIT 256KB FLASH 100LQFP
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-AU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Controller Family/series: ATSAM3S
• No. Of I/o's: 79
• Ram Memory Size: 48KB
• Cpu Speed: 64MHz
• No. Of Timers: 6
• Rohs Compliant: Yes
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Cpu Family: AT91
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 64MHz
• Total Internal Ram Size: 48KB
• # I/os (max): 79
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.62V
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

23.7
23.7.1
23.7.1.1
23.7.1.2
23.7.1.3
366
Application Example
SAM3S Preliminary
Implementation Examples
8-bit NAND Flash
Hardware Configuration
Software Configuration
Hardware configurations are given for illustration only. The user should refer to the manufacturer
web site to check for memory device availability.
For Hardware implementation examples, please refer to ATSAM3S-EK schematics, which show
examples of a connection to an LCD module and NAND Flash.
Perform the following configuration:
In this example, the NAND Flash is not addressed as a “CE don’t care”. To address it as a “CE
don’t care”, connect NCS3 (if SMC_NFCS3 is set) to the NAND Flash CE.
• Assign the SMC_NFCSx (for example SMC_NFCS3) field in the CCFG_SMCNFCS Register
• Reserve A21 / A22 for ALE / CLE functions. Address and Command Latches are controlled
• NANDOE and NANDWE signals are multiplexed with PIO lines. Thus, the dedicated PIOs
• Configure a PIO line as an input to manage the Ready/Busy signal.
• Configure Static Memory Controller CS3 Setup, Pulse, Cycle and Mode according to NAND
(ANY PIO)
NANDOE
NANDWE
(ANY PIO)
on the Bus Matrix User Interface.
respectively by setting to 1 the address bits A21 and A22 during accesses.
must be programmed in peripheral mode in the PIO controller.
Flash timings, the data bus width and the system bus frequency.
D[0..7]
CLE
ALE
3V3
R1
R1
R2
R2
10K
10K
10K
10K
16
17
18
19
10
11
14
15
20
21
22
23
24
25
26
8
9
7
1
2
3
4
5
6
U1
U1
CLE
ALE
RE
WE
CE
R/B
WP
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
TSOP48 PACKAGE
2 Gb
K9F2G08U0M
K9F2G08U0M
PRE
VCC
VCC
VSS
VSS
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
29
30
31
32
41
42
43
44
48
47
46
45
40
39
38
35
34
33
28
27
37
12
36
13
D0
D1
D2
D3
D4
D5
D6
D7
C1
C1
100NF
100NF
3V3
C2
C2
100NF
100NF
6500C–ATARM–8-Feb-11