HPIXF1104BE.B1-994579 Cortina Systems Inc, HPIXF1104BE.B1-994579 Datasheet - Page 213

• Manufacturer Part Number: HPIXF1104BE.B1-994579
• Description: IC ETH MAC SPI3 4PORT 552-BGA
• Manufacturer: Cortina Systems Inc

Specifications of HPIXF1104BE.B1-994579

• Controller Type: Ethernet Controller, MAC
• Interface: SPI-3
• Voltage - Supply: 1.2V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 575-BCBGA Exposed Pad (552 Bumps)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Other names: 1008-1020

IXF1104 MAC
Datasheet
278757, Revision 13.2
17 September 2008
9.0
9.1
9.1.1
9.2
9.3
Table 156
Note:
Cortina Systems
IXF1104 Leaded
IXF1104 RoHS
IXF1104 Leaded
IXF1104 RoHS
Product Name
Mechanical Specifications
The IXF1104 MAC is packaged in a 576-ball BGA package with 6 balls removed diagonally
from each corner, for a total of 552 balls used measuring 25 mm x 25 mm. The pitch of the
package balls is 1 mm.
Overview
CBGA (standard and RoHS-compliant) and FC-PBGA packages are suited for applications
requiring high I/O counts and high electrical performance, and are recommended for high-
power applications with high noise immunity requirements.
Features
Package Specifics
The IXF1104 MAC uses the following package:
Package Information
Package Description
Cortina Systems
information can be found at www.cortina-systems.com.
®
• Flip chip die attach; surface mount second-level interconnect
• High electrical performance
• High I/O counts
• Area array I/O options
• Multiple power-zone offering supports core and four additional voltages
• JEDEC-compliant package
• 576-ball BGA package with 6 balls removed diagonally from each corner, for a total of
• Ball pitch of 1.0 mm
• Overall package dimensions of 25 mm x 25 mm
IXF1104 4-Port Gigabit Ethernet Media Access Controller
552 balls used
®
IXF1104 4-Port Gigabit Ethernet Media Access Controller ordering
552 CBGA Leaded
552 CBGA RoHS
552 FC-PBGA Leaded
552 FC-PBGA RoHS
Package
2.48 max, 2.02 min
2.48 max, 2.02 min
1.34 max, 1.09 min
1.34 max, 1.09 min
Substrate
Thickness
0.8 +/- .04 mm
0.7 +/- 0.1 mm
0.6 +/- 0.1 mm
0.6 +/- 0.1 mm
Solder Ball Diameter
Page 213