A3PN125-ZVQG100 Actel, A3PN125-ZVQG100 Datasheet - Page 19

FPGA - Field Programmable Gate Array 125K System Gates ProASIC3 nano

A3PN125-ZVQG100

Manufacturer Part Number
A3PN125-ZVQG100
Description
FPGA - Field Programmable Gate Array 125K System Gates ProASIC3 nano
Manufacturer
Actel
Datasheet

Specifications of A3PN125-ZVQG100

Processor Series
A3PN125
Core
IP Core
Number Of Macrocells
1024
Maximum Operating Frequency
350 MHz
Number Of Programmable I/os
71
Data Ram Size
36 Kbit
Delay Time
1.02 ns
Supply Voltage (max)
3.3 V
Supply Current
2 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 20 C
Development Tools By Supplier
AGLN-Nano-Kit, AGLN-Z-Nano-Kit, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FloasPro 4, FlashPro 3, FlashPro Lite
Mounting Style
SMD/SMT
Supply Voltage (min)
1.5 V
Number Of Gates
125 K
Package / Case
VQFP-100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 2-5 • Package Thermal Resistivities
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays
Package Type
Quad Flat No Lead (QFN)
Very Thin Quad Flat Pack (VQFP)
Array Voltage VCC (V)
1.425
1.500
1.575
Maximum Power Allowed
(normalized to T
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction to be higher than the ambient temperature.
EQ 1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 100°C.
allowed for a 484-pin FBGA package at commercial temperature and in still air.
Temperature and Voltage Derating Factors
A
ja
ja
. The thermal characteristics for θ
= Ambient Temperature
= Junction-to-ambient of the package. θ
T
J
can be used to calculate junction temperature.
= Junction Temperature = ΔT + T
=
J
= 70°C, VCC = 1.425 V)
Max. junction temp. (°C) Max. ambient temp. (°C)
----------------------------------------------------------------------------------------------------------------------------------------- -
–40°C
0.968
0.888
0.836
EQ 2
All devices
All devices
Device
shows a sample calculation of the absolute maximum power dissipation
–20°C
0.973
0.894
0.841
ja
θ
are shown for two air flow rates. The absolute maximum junction
ja
Pin Count
A
(°C/W)
100
100
ja
48
68
R e v i s i o n 8
0.979
0.899
0.845
numbers are located in
Junction Temperature (°C)
0°C
jc
TBD
TBD
TBD
10.0
and the junction-to-ambient air thermal resistivity is
θ
jc
0.991
0.910
0.856
25°C
Still Air 200 ft./min.
TBD
TBD
TBD
35.3
Table
1.000
0.919
0.864
=
70°C
100°C 70°C
------------------------------------ -
ja
TBD
TBD
TBD
29.4
20.5°C/W
2-5.
* P
θ
ja
ProASIC3 nano Flash FPGAs
1.006
0.924
0.870
85°C
500 ft./min.
=
TBD
TBD
TBD
27.1
1.463 W
100°C
1.013
0.930
0.875
·
Units
C/W
C/W
C/W
C/W
EQ 1
EQ 2
2 -5

Related parts for A3PN125-ZVQG100