TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 382
![no-image](/images/manufacturer_photos/0/3/324/idt__integrated_device_technology_inc_sml.jpg)
TSI148-133CL
Manufacturer Part Number
TSI148-133CL
Description
IC PCI-VME BRIDGE 456PBGA
Manufacturer
IDT, Integrated Device Technology Inc
Series
Tsi148&Trade;r
Datasheets
1.TSI148-133CL.pdf
(391 pages)
2.TSI148-133CL.pdf
(2 pages)
3.TSI148-133CL.pdf
(12 pages)
Specifications of TSI148-133CL
Applications
PCI-to-VME Bridge
Interface
PCI
Voltage - Supply
3.3V
Package / Case
456-PBGA
Mounting Type
Surface Mount
Package Type
BGA
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
800-1906
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TSI148-133CL
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
TSI148-133CLY
Manufacturer:
TUNDRA
Quantity:
355
- Current page: 382 of 391
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B. Hardware Implementation > Capacitance Decoupling Recommendations
B.2
382
Capacitance Decoupling Recommendations
IDT considers it a good design practice to have decoupling capacitors closely positioned to
Tsi148’s 3.3V and 1.8V pins. IDT recommends at least 20 0.1uF ceramic surface mount
capacitors on the 3.3V pin and 20 on the 1.8V pin. The inductance of the decoupling
capacitors can be minimized by keeping the traces short and wide. For example, the traces
should be as wide as the capacitor pad.
–
–
–
–
–
–
–
R1 = 2.2 ohm
R2 = 2.2 ohm
R3 = not installed
L = 820 nH
C1 = 2.2 uF
C2 = 0.1 uF
C3 = 10 uF
Tsi148 PCI/X-to-VME Bus Bridge User Manual
80A3020_MA001_13
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