TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 382

• Manufacturer Part Number: TSI148-133CL
• Description: IC PCI-VME BRIDGE 456PBGA
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: Tsi148&Trade;r

Specifications of TSI148-133CL

• Applications: PCI-to-VME Bridge
• Interface: PCI
• Voltage - Supply: 3.3V
• Package / Case: 456-PBGA
• Mounting Type: Surface Mount
• Package Type: BGA
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-1906

B. Hardware Implementation > Capacitance Decoupling Recommendations
B.2
382
Capacitance Decoupling Recommendations
IDT considers it a good design practice to have decoupling capacitors closely positioned to
Tsi148’s 3.3V and 1.8V pins. IDT recommends at least 20 0.1uF ceramic surface mount
capacitors on the 3.3V pin and 20 on the 1.8V pin. The inductance of the decoupling
capacitors can be minimized by keeping the traces short and wide. For example, the traces
should be as wide as the capacitor pad.
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R1 = 2.2 ohm
R2 = 2.2 ohm
R3 = not installed
L = 820 nH
C1 = 2.2 uF
C2 = 0.1 uF
C3 = 10 uF
Tsi148 PCI/X-to-VME Bus Bridge User Manual
80A3020_MA001_13