TSI148-133CL IDT, Integrated Device Technology Inc, TSI148-133CL Datasheet - Page 384
![no-image](/images/manufacturer_photos/0/3/324/idt__integrated_device_technology_inc_sml.jpg)
TSI148-133CL
Manufacturer Part Number
TSI148-133CL
Description
IC PCI-VME BRIDGE 456PBGA
Manufacturer
IDT, Integrated Device Technology Inc
Series
Tsi148&Trade;r
Datasheets
1.TSI148-133CL.pdf
(391 pages)
2.TSI148-133CL.pdf
(2 pages)
3.TSI148-133CL.pdf
(12 pages)
Specifications of TSI148-133CL
Applications
PCI-to-VME Bridge
Interface
PCI
Voltage - Supply
3.3V
Package / Case
456-PBGA
Mounting Type
Surface Mount
Package Type
BGA
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
800-1906
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TSI148-133CL
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
TSI148-133CLY
Manufacturer:
TUNDRA
Quantity:
355
- Current page: 384 of 391
- Download datasheet (2Mb)
B. Hardware Implementation > Recommended Board Layout Guidelines
B.3.2
384
Recommended Stackup
The Tsi148 has been designed successfully using an 18 layer PCB Stackup. It may be
possible to use a lower layer count, however this design has not been tested. Below is an
example of the 18 layer count stackup used on a working Tsi148 board design.
Board Stackup:
1. Signal
2. Signal
3. Signal
4. Signal
5. VSS
6. Signal
7. Signal
8. VSS
9. VDD33
10. VDD18
11. VSS
12. Signal
13. Signal
14. VSS
15. Signal
16. Signal
17. Signal
18. Signal
Tsi148 PCI/X-to-VME Bus Bridge User Manual
80A3020_MA001_13
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