SAM9RL64 Atmel Corporation, SAM9RL64 Datasheet - Page 223

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SAM9RL64

Manufacturer Part Number
SAM9RL64
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9RL64

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
240 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
118
Ext Interrupts
118
Usb Transceiver
1
Usb Speed
Hi-Speed
Usb Interface
Device
Spi
1
Twi (i2c)
2
Uart
5
Ssc
2
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Adc Channels
6
Adc Resolution (bits)
10
Adc Speed (ksps)
220
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No / Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
23.6.4
Register Name:
Access Type:
Reset Value:
• LPCB: Low-power Configuration Bits
• PASR: Partial Array Self-refresh (only for low-power SDRAM)
PASR parameter is transmitted to the SDRAM during initialization to specify whether only one quarter, one half or all banks
of the SDRAM array are enabled. Disabled banks are not refreshed in self-refresh mode. This parameter must be set
according to the SDRAM device specification.
After initialization, as soon as PASR field is modified and self-refresh mode is activated, the Extended Mode Register is
accessed automatically and PASR bits are updated before entry in self-refresh mode.
• TCSR: Temperature Compensated Self-Refresh (only for low-power SDRAM)
TCSR parameter is transmitted to the SDRAM during initialization to set the refresh interval during self-refresh mode
depending on the temperature of the low-power SDRAM. This parameter must be set according to the SDRAM device
specification.
After initialization, as soon as TCSR field is modified and self-refresh mode is activated, the Extended Mode Register is
accessed automatically and TCSR bits are updated before entry in self-refresh mode.
• DS: Drive Strength (only for low-power SDRAM)
DS parameter is transmitted to the SDRAM during initialization to select the SDRAM strength of data output. This parame-
ter must be set according to the SDRAM device specification.
6289D–ATARM–3-Oct-11
31
23
15
7
00
01
10
11
SDRAMC Low Power Register
Low Power Feature is inhibited: no Power-down, Self-refresh or Deep Power-down command is issued to the
SDRAM device.
The SDRAM Controller issues a Self-refresh command to the SDRAM device, the SDCLK clock is deactivated
and the SDCKE signal is set low. The SDRAM device leaves the Self Refresh Mode when accessed and enters
it after the access.
The SDRAM Controller issues a Power-down Command to the SDRAM device after each access, the SDCKE
signal is set to low. The SDRAM device leaves the Power-down Mode when accessed and enters it after the
access.
The SDRAM Controller issues a Deep Power-down command to the SDRAM device. This mode is unique to
low-power SDRAM.
30
22
14
SDRAMC_LPR
Read/Write
0x0
6
PASR
29
21
13
5
TIMEOUT
28
20
12
4
27
19
11
3
DS
AT91SAM9R64/RL64
26
18
10
2
25
17
9
1
TCSR
LPCB
24
16
8
0
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