mt46h32m32lfcm-6 Micron Semiconductor Products, mt46h32m32lfcm-6 Datasheet - Page 13

• Manufacturer Part Number: mt46h32m32lfcm-6
• Description: 1gb X16, X32 Mobile Ddr Sdram
• Manufacturer: Micron Semiconductor Products

Figure 7:
PDF: 09005aef82ce3074/Source: 09005aef82cd0158
1gb_ddr_mobile_sdram_t48m_density__2.fm - Rev. G 07/08 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
11.2
Seating
90X Ø0.45
plane
0.1 A
0.8 TYP
90-Ball VFBGA Package
5.6
Notes:
A
9 8
1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
3.2
7
10 ±0.1
6.4
5 ±0.05
3 2
1
0.8 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
Ball A1 ID
13
13 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
1Gb: x16, x32 Mobile DDR SDRAM
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved
Ball A1 ID