DSPIC30F3010-20I/SP Microchip Technology, DSPIC30F3010-20I/SP Datasheet - Page 170

• Manufacturer Part Number: DSPIC30F3010-20I/SP
• Description: IC DSPIC MCU/DSP 24K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3010-20I/SP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 24KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301020ISP

dsPIC30F3010/3011
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70141F-page 170
dsPIC30F301X-30I
dsPIC30F301X-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 40-pin PDIP (P)
Package Thermal Resistance, 44-pin TQFP (PT, 10x10x1 mm)
Package Thermal Resistance, 44-pin QFN (ML)
Note 1:
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
I
INT
/
Junction to ambient thermal resistance, Theta-ja (θ
Range
O
=
=
∑
V
(
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
{
DD
V
×
DD
(
I
–
D D
V
Characteristic
–
OH
∑
Rating
}
×
I
O H
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
I
Temp Range
OH
)
)
+
∑
(
V
O L
×
I
OL
)
dsPIC30F301X-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
20
10
—
—
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
42
49
37
45
28
(T
© 2010 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
—
—
—
dsPIC30F301X-20E
+ P
A
)/θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
20
15
Max
Unit
—
—
—
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1