DSPIC30F3010-20I/SP Microchip Technology, DSPIC30F3010-20I/SP Datasheet - Page 217

• Manufacturer Part Number: DSPIC30F3010-20I/SP
• Description: IC DSPIC MCU/DSP 24K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3010-20I/SP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 24KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301020ISP

APPENDIX A:
Revision B (May 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were
distributed with incomplete characterization data.
This revision reflects these updates:
• Supported I
• ADC Conversion Clock selection to allow 1 Msps
• Operating Current (I
• Power-Down Current (I
• I/O pin Input Specifications
• BOR voltage limits
• Watchdog Timer time-out limits
Revision C (September 2006)
Updates
Characteristics”.
Revision D (January 2007)
This revision includes updates to the packaging
diagrams.
© 2010 Microchip Technology Inc.
(see
operation (see
Analog-to-Digital Converter (ADC)
(see
(see
(see
(see
(see
Table
Table
Table
Table
Table
Table
made
17-1)
23-5)
23-7)
23-8)
23-10)
23-20)
2
C Slave Addresses
Section 19.0 “10-bit High-Speed
to
DD
REVISION HISTORY
) Specifications
PD
Section 23.0
)
Module”)
“Electrical
Revision E (April 2008)
This revision reflects these updates:
• Added OSCTUN register information and updated
• Changed the location of the input reference in the
• Added Fuse Configuration Register (FICD) details
• Added Note 2 in Device Configuration Registers
• Updated FOSC register bit definition in Device
• Electrical Specifications:
• Additional minor corrections throughout the
the OSCCON register information (removed TUN
bits) in System Integration Register Map (see
Table
10-Bit High-Speed ADC Functional Block
Diagram (see
(see
Registers”
table
Configuration Registers table
- Updated values for parameters DO10, DO16,
- 10-Bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention Volt-
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated Min and Max values and Conditions
document
dsPIC30F3010/3011
DO20, and DO26 (see
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table
age) has been updated to include a Min value
(see
has been updated to include Min and Max
values and the Typ value has been removed
(see
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table
has been expanded to reflect multiple Min
and Max values for different temperatures
(see
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for
parameter SY20 (see
Section 20.6 “Device Configuration
(Table
20-7)
Table
Table
Table
23-39)
23-18)
23-17)
and
20-8)
23-4)
23-11)
23-17)
Figure
Table
19-1)
20-8)
Table
Table
PDU
(Table
23-20)
23-9)
timing parame-
DS70141F-page 217
20-8)