MCU ARM 64KB FLASH/TIMER 100LQFP

STM32F101V8T6

Manufacturer Part NumberSTM32F101V8T6
DescriptionMCU ARM 64KB FLASH/TIMER 100LQFP
ManufacturerSTMicroelectronics
SeriesSTM32
STM32F101V8T6 datasheet
 

Specifications of STM32F101V8T6

Core ProcessorARM® Cortex-M3™Core Size32-Bit
Speed36MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsDMA, PDR, POR, PVD, PWM, Temp Sensor, WDTNumber Of I /o80
Program Memory Size64KB (64K x 8)Program Memory TypeFLASH
Ram Size10K x 8Voltage - Supply (vcc/vdd)2 V ~ 3.6 V
Data ConvertersA/D 16x12bOscillator TypeInternal
Operating Temperature-40°C ~ 85°CPackage / Case100-LQFP
Processor SeriesSTM32F101xCoreARM Cortex M3
Data Bus Width32 bitData Ram Size10 KB
Interface TypeI2C, SPI, USARTMaximum Clock Frequency36 MHz
Number Of Programmable I/os100Number Of Timers3 x 16 bit
Operating Supply Voltage2 V to 3.6 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature- 40 COn-chip Adc12 bit, 16 Channel
For Use With497-10030 - STARTER KIT FOR STM32497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCULead Free Status / RoHS StatusLead free / RoHS Compliant
Eeprom Size-Other names497-6060
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Description
2.2
Full compatibility throughout the family
The STM32F101xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are
referred to as low-density devices, the STM32F101x8 and STM32F101xB are referred to as
medium-density devices, and the STM32F101xC, STM32F101xD and STM32F101xE are
referred to as high-density devices.
Low- and high-density devices are an extension of the STM32F101x8/B devices, they are
specified in the STM32F101x4/6 and STM32F101xC/D/E datasheets, respectively. Low-
density devices feature lower Flash memory and RAM capacities and a timer less. High-
density devices have higher Flash memory and RAM capacities, and additional peripherals
like FSMC and DAC, while remaining fully compatible with the other members of the
STM32F101xx family.
The STM32F101x4, STM32F101x6, STM32F101xC, STM32F101xD and STM32F101xE
are a drop-in replacement for the STM32F101x8/B medium-density devices, allowing the
user to try different memory densities and providing a greater degree of freedom during the
development cycle.
Moreover, the STM32F101xx performance line family is fully compatible with all existing
STM32F101xx access line and STM32F102xx USB access line devices.
Table 3.
STM32F101xx family
Low-density devices
16 KB
Pinout
Flash
4 KB RAM 6 KB RAM 10 KB RAM 16 KB RAM
144
100
64
2 × USARTs
2 × 16-bit timers
48
1 × SPI, 1 × I
1 × ADC
36
1. For orderable part numbers that do not show the A internal code after the temperature range code (6), the
reference datasheet for electrical characteristics is that of the STM32F101x8/B medium-density devices.
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Memory size
Medium-density devices
32 KB
64 KB
128 KB
(1)
Flash
Flash
Flash
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I2Cs,
2
C
1 × ADC
Doc ID 13586 Rev 14
STM32F101x8, STM32F101xB
High-density devices
256 KB
384 KB
512 KB
Flash
Flash
Flash
32 KB
48 KB
48 KB
RAM
RAM
RAM
5 × USARTs
4 × 16-bit timers, 2 × basic timers
2
3 × SPIs, 2 × I
Cs, 1 × ADC,
2 × DACs, FSMC (100 and 144 pins)