MCU ARM 64KB FLASH/TIMER 100LQFP

STM32F101V8T6

Manufacturer Part NumberSTM32F101V8T6
DescriptionMCU ARM 64KB FLASH/TIMER 100LQFP
ManufacturerSTMicroelectronics
SeriesSTM32
STM32F101V8T6 datasheet
 


Specifications of STM32F101V8T6

Core ProcessorARM® Cortex-M3™Core Size32-Bit
Speed36MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsDMA, PDR, POR, PVD, PWM, Temp Sensor, WDTNumber Of I /o80
Program Memory Size64KB (64K x 8)Program Memory TypeFLASH
Ram Size10K x 8Voltage - Supply (vcc/vdd)2 V ~ 3.6 V
Data ConvertersA/D 16x12bOscillator TypeInternal
Operating Temperature-40°C ~ 85°CPackage / Case100-LQFP
Processor SeriesSTM32F101xCoreARM Cortex M3
Data Bus Width32 bitData Ram Size10 KB
Interface TypeI2C, SPI, USARTMaximum Clock Frequency36 MHz
Number Of Programmable I/os100Number Of Timers3 x 16 bit
Operating Supply Voltage2 V to 3.6 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature- 40 COn-chip Adc12 bit, 16 Channel
For Use With497-10030 - STARTER KIT FOR STM32497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCULead Free Status / RoHS StatusLead free / RoHS Compliant
Eeprom Size-Other names497-6060
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STM32F101x8, STM32F101xB
Table 54.
Document revision history (continued)
Date
Revision
21-Apr-2009
22-Sep-2009
I/O information clarified
on page
In
Table 4: Medium-density STM32F101xx pin
PB14, PB15, PB3/TRACESWO moved from Default column to Remap
column.
Note modified in
Table 12: Maximum current consumption in Run mode,
code with data processing running from Flash
11
current consumption in Sleep mode, code running from Flash or
Figure
16,
Figure 17
and
Table 19: High-speed external user clock characteristics
Low-speed external user clock characteristics
ACC
max values modified in
HSI
Small text changes.
Note 5
updated and
Note 4
STM32F101xx pin
definitions.
V
and T
added to
RERINT
Coeff
voltage. Typical I
DD_VBAT
current consumptions in Stop and Standby
current consumption on VBAT with RTC on versus temperature at
different VBAT values
added.
f
min modified in
Table 19: High-speed external user clock
HSE_ext
characteristics.
C
and C
replaced by C in
L1
L2
characteristics
and
Table 22: LSE oscillator characteristics (fLSE =
32.768
kHz), notes modified and moved below the tables.
12
Table 23: HSI oscillator characteristics
from
Table 25: Low-power mode wakeup
Figure 28: Recommended NRST pin protection
Note 1
modified below
Figure 21: Typical application with an 8 MHz
crystal.
Figure 28: Recommended NRST pin protection
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Section 5.3.10: EMC characteristics on page
Jitter added to
Table 26: PLL
modified in
Table 42: ADC
Table 43: RAIN max for fADC = 14
Small text changes.
Doc ID 13586 Rev 14
Revision history
Changes
1.
Figure 8: Memory map
definitions: PB4, PB13,
and
Table 14: Maximum
Figure 18
show typical curves.
and
modified.
Table 23: HSI oscillator
characteristics.
added in
Table 4: Medium-density
Table 11: Embedded internal reference
value added in
Table 15: Typical and maximum
modes.
Figure 15: Typical
Table 21: HSE 4-16 MHz oscillator
modified. Conditions removed
timings.
modified.
modified.
characteristics. C
and R
ADC
AIN
characteristics. R
max values modified in
AIN
MHz.
modified.
RAM.
Table 20:
50.
parameters
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