STM32F101V8T6 STMicroelectronics, STM32F101V8T6 Datasheet - Page 68

MCU ARM 64KB FLASH/TIMER 100LQFP

STM32F101V8T6

Manufacturer Part Number
STM32F101V8T6
Description
MCU ARM 64KB FLASH/TIMER 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101V8T6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
100
Number Of Timers
3 x 16 bit
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-6060
Electrical characteristics
Table 45.
ADC accuracy
Symbol
ET
Total unadjusted error
EO
Offset error
EG
Gain error
ED
Differential linearity error
EL
Integral linearity error
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
4. Based on characterization, not tested in production.
Figure 33. ADC accuracy characteristics
V
[1LSB
=
IDEAL
4095
4094
4093
7
6
5
E
O
4
3
2
1
0
1
2
V
SSA
68/87
(1) (2) (3)
Parameter
Test conditions
f
= 28 MHz,
PCLK2
f
= 14 MHz, R
ADC
V
= 2.4 V to 3.6 V
DDA
Measurements made after
ADC calibration
DD
V
REF+
DDA
(or
depending on package)]
4096
4096
(2)
E
T
(3)
(1)
E
L
E
D
1 LSB
IDEAL
3
4
5
6
7
4093 4094 4095 4096
Doc ID 13586 Rev 14
STM32F101x8, STM32F101xB
Typ
Max
±2
±1.5
±2.5
< 10 kΩ,
AIN
±1.5
±1
±1.5
, frequency, V
and temperature ranges.
REF
and ΣI
in
Section 5.3.12
INJ(PIN)
INJ(PIN)
E
G
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
=Total Unadjusted Error: maximum deviation
T
between the actual and the ideal transfer curves.
E
=Offset Error: deviation between the first actual
O
transition and the first ideal one.
E
=Gain Error: deviation between the last ideal
G
transition and the last actual one.
E
=Differential Linearity Error: maximum deviation
D
between actual steps and the ideal one.
E
=Integral Linearity Error: maximum deviation
L
between any actual transition and the end point
correlation line.
V
DDA
(4)
Unit
±5
±3
LSB
±2
±3
does not
ai14395b

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