MCU ARM 64KB FLASH/TIMER 100LQFP

STM32F101V8T6

Manufacturer Part NumberSTM32F101V8T6
DescriptionMCU ARM 64KB FLASH/TIMER 100LQFP
ManufacturerSTMicroelectronics
SeriesSTM32
STM32F101V8T6 datasheet
 

Specifications of STM32F101V8T6

Core ProcessorARM® Cortex-M3™Core Size32-Bit
Speed36MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsDMA, PDR, POR, PVD, PWM, Temp Sensor, WDTNumber Of I /o80
Program Memory Size64KB (64K x 8)Program Memory TypeFLASH
Ram Size10K x 8Voltage - Supply (vcc/vdd)2 V ~ 3.6 V
Data ConvertersA/D 16x12bOscillator TypeInternal
Operating Temperature-40°C ~ 85°CPackage / Case100-LQFP
Processor SeriesSTM32F101xCoreARM Cortex M3
Data Bus Width32 bitData Ram Size10 KB
Interface TypeI2C, SPI, USARTMaximum Clock Frequency36 MHz
Number Of Programmable I/os100Number Of Timers3 x 16 bit
Operating Supply Voltage2 V to 3.6 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature- 40 COn-chip Adc12 bit, 16 Channel
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Eeprom Size-Other names497-6060
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Page 77/87

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STM32F101x8, STM32F101xB
6.2
Thermal characteristics
The maximum chip junction temperature (T
Table 8: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
max is the maximum ambient temperature in °C,
●
T
A
Θ
is the package junction-to-ambient thermal resistance, in °C/W,
●
JA
●
P
max is the sum of P
D
●
P
max is the product of I
INT
internal power.
P
max represents the maximum power dissipation on output pins where:
I/O
max = Σ (V
P
I/O
taking into account the actual V
application.
Table 52.
Package thermal characteristics
Symbol
Thermal resistance junction-ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
Θ
JA
LQFP 48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 48 - 6 x 6 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
max) must never exceed the values given in
J
32.
max, in degrees Celsius, may be calculated
J
T
max = T
max + (P
J
A
max and P
max (P
INT
I/O
and V
, expressed in Watts. This is the maximum chip
DD
DD
) + Σ((V
× I
– V
) × I
OL
OL
DD
OH
OH
/ I
and V
/ I
OL
OL
OH
Parameter
Doc ID 13586 Rev 14
Package characteristics
max x Θ
)
D
JA
max = P
max + P
max),
D
INT
I/O
),
of the I/Os at low and high level in the
OH
Value
46
45
55
16
18
Unit
°C/W
77/87

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