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STM32F101V8T6
STM32F101V8T6 | |
---|---|
Manufacturer Part Number | STM32F101V8T6 |
Description | MCU ARM 64KB FLASH/TIMER 100LQFP |
Manufacturer | STMicroelectronics |
Series | STM32 |
STM32F101V8T6 datasheet |
|
Specifications of STM32F101V8T6 | |||
---|---|---|---|
Core Processor | ARM® Cortex-M3™ | Core Size | 32-Bit |
Speed | 36MHz | Connectivity | I²C, IrDA, LIN, SPI, UART/USART |
Peripherals | DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT | Number Of I /o | 80 |
Program Memory Size | 64KB (64K x 8) | Program Memory Type | FLASH |
Ram Size | 10K x 8 | Voltage - Supply (vcc/vdd) | 2 V ~ 3.6 V |
Data Converters | A/D 16x12b | Oscillator Type | Internal |
Operating Temperature | -40°C ~ 85°C | Package / Case | 100-LQFP |
Processor Series | STM32F101x | Core | ARM Cortex M3 |
Data Bus Width | 32 bit | Data Ram Size | 10 KB |
Interface Type | I2C, SPI, USART | Maximum Clock Frequency | 36 MHz |
Number Of Programmable I/os | 100 | Number Of Timers | 3 x 16 bit |
Operating Supply Voltage | 2 V to 3.6 V | Maximum Operating Temperature | + 85 C |
Mounting Style | SMD/SMT | 3rd Party Development Tools | EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2 |
Minimum Operating Temperature | - 40 C | On-chip Adc | 12 bit, 16 Channel |
For Use With | 497-10030 - STARTER KIT FOR STM32497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Eeprom Size | - | Other names | 497-6060 |
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STM32F101x8, STM32F101xB
6.2
Thermal characteristics
The maximum chip junction temperature (T
Table 8: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
max is the maximum ambient temperature in °C,
●
T
A
Θ
is the package junction-to-ambient thermal resistance, in °C/W,
●
JA
●
P
max is the sum of P
D
●
P
max is the product of I
INT
internal power.
P
max represents the maximum power dissipation on output pins where:
I/O
max = Σ (V
P
I/O
taking into account the actual V
application.
Table 52.
Package thermal characteristics
Symbol
Thermal resistance junction-ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
Θ
JA
LQFP 48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 48 - 6 x 6 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
max) must never exceed the values given in
J
32.
max, in degrees Celsius, may be calculated
J
T
max = T
max + (P
J
A
max and P
max (P
INT
I/O
and V
, expressed in Watts. This is the maximum chip
DD
DD
) + Σ((V
× I
– V
) × I
OL
OL
DD
OH
OH
/ I
and V
/ I
OL
OL
OH
Parameter
Doc ID 13586 Rev 14
Package characteristics
max x Θ
)
D
JA
max = P
max + P
max),
D
INT
I/O
),
of the I/Os at low and high level in the
OH
Value
46
45
55
16
18
Unit
°C/W
77/87
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