DSPIC33FJ64MC510T-I/PT Microchip Technology, DSPIC33FJ64MC510T-I/PT Datasheet - Page 312

IC DSPIC MCU/DSP 64K 100TQFP

DSPIC33FJ64MC510T-I/PT

Manufacturer Part Number
DSPIC33FJ64MC510T-I/PT
Description
IC DSPIC MCU/DSP 64K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ64MC510T-I/PT

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFQFP
For Use With
AC164333 - MODULE SKT FOR PM3 100QFPMA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ64MC510T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ64MC510T-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC33F
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
TABLE 26-4:
DS70165E-page 310
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
Characteristic
DC5
dsPIC33F
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Note 1:
Param
No.
2:
Operating Junction Temperature Range
DC Characteristics
P
I/O =
Operating Ambient Temperature Range
Supply Voltage
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
This is the limit to which V
Junction to ambient thermal resistance, Theta-
= V
({V
DD
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
DD
x (I
DD
DD
– V
V
DD
Start Voltage
Rise Rate
(in Volts)
DD
3.0-3.6V
OH
Characteristic
Range
Characteristic
} x I
Rating
I
OH
OH
)
) +
DD
(V
can be lowered without losing RAM data.
OL
x I
OL
(2)
)
Preliminary
-40°C to +85°C
Temp Range
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
(in °C)
0.05
Min
3.0
JA
(
JA
) numbers are achieved by package simulations.
Typ
V
2.8
SS
Symbol
Symbol
P
(1)
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
Max
3.6
-40°C T
48.4
52.3
38.7
38.3
Min
Typ
-40
-40
Units
V/ms 0-3.3V in 0.1s
V
V
V
(T
© 2007 Microchip Technology Inc.
P
A
J
INT
– T
Max
Typ
0-2.5V in 60 ms
Max MIPS
dsPIC33F
+ P
+85°C for Industrial
A
)/
40
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1

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