ST62T65CM6 STMicroelectronics, ST62T65CM6 Datasheet - Page 64

IC MCU 8BIT OTP/EPROM 28 PSOIC

ST62T65CM6

Manufacturer Part Number
ST62T65CM6
Description
IC MCU 8BIT OTP/EPROM 28 PSOIC
Manufacturer
STMicroelectronics
Series
ST6r
Datasheet

Specifications of ST62T65CM6

Core Processor
ST6
Core Size
8-Bit
Speed
8MHz
Connectivity
SPI
Peripherals
LED, LVD, POR, WDT
Number Of I /o
21
Program Memory Size
3.8KB (3.8K x 8)
Program Memory Type
OTP
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 6 V
Data Converters
A/D 13x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
ST6
No. Of I/o's
21
Eeprom Memory Size
128Byte
Ram Memory Size
128Byte
Cpu Speed
8MHz
No. Of Timers
2
Rohs Compliant
Yes
Processor Series
ST62T6x
Core
ST6
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
21
Number Of Timers
1
Operating Supply Voltage
3 V to 6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST62GP-EMU2, ST62E2XC-EPB/110, ST62E6XC-EPB/US, STREALIZER-II
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-2103-5
ST6255C ST6265C ST6265B
6 ELECTRICAL CHARACTERISTICS
6.1 ABSOLUTE MAXIMUM RATINGS
This product contains devices to protect the inputs
against damage due to high static voltages, how-
ever it is advisable to take normal precaution to
avoid application of any voltage higher than the
specified maximum rated voltages.
For proper operation it is recommended that V
and V
Reliability is enhanced if unused inputs are con-
nected to an appropriate logic voltage level (V
or V
Notes:
- Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and
- (1) Within these limits, clamping diodes are guarantee to be not conductive. Voltages outside these limits are authorised as long as injection
64/84
functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
current is kept within the specification.
SS
Symbol
T
O
IV
IV
).
V
V
STG
V
Tj
DD
DD
SS
O
be higher than V
I
Supply Voltage
Input Voltage
Output Voltage
Total Current into V
Total Current out of V
Junction Temperature
Storage Temperature
SS
and lower than V
DD
Parameter
SS
(source)
(sink)
DD
DD
.
I
Power Considerations.The average chip-junc-
tion temperature, Tj, in Celsius can be obtained
from:
Where:TA = Ambient Temperature.
Tj=TA + PD x RthJA
RthJA =Package thermal resistance (junc-
PD = Pint + Pport.
Pint =IDD x VDD (chip internal power).
Pport =Port power dissipation (determined
V
V
SS
SS
tion-to ambient).
by the user).
- 0.3 to V
- 0.3 to V
-0.3 to 7.0
-60 to 150
Value
150
100
80
DD
DD
+ 0.3
+ 0.3
(1)
(1)
Unit
mA
mA
°C
°C
V
V
V

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