HD6417750SBP200 Renesas Electronics America, HD6417750SBP200 Datasheet - Page 482

IC SUPERH MPU ROMLESS 256BGA

HD6417750SBP200

Manufacturer Part Number
HD6417750SBP200
Description
IC SUPERH MPU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SBP200

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 2.07 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750SBP200
Manufacturer:
HITACHI
0
Part Number:
HD6417750SBP200
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Section 13 Bus State Controller (BSC)
• When DRAM or Synchronous DRAM Interface is Set*
Bit 11: A2W2
0
1
Notes: 1. External wait input is always ignored.
Bits 8 to 6—Area 1 Wait Control (A1W2–A1W0): These bits specify the number of wait states
to be inserted for area 1. For details on MPX interface setting, see table 13.6, MPX Interface is
Selected (Areas 0 to 6).
Bit 8: A1W2
0
1
Rev.7.00 Oct. 10, 2008 Page 396 of 1074
REJ09B0366-0700
2. RAS down mode is prohibited.
Bit 10: A2W1
0
1
0
1
Bit 7: A1W1
0
1
0
1
Bit 9: A2W0
0
1
0
1
0
1
0
1
Bit 6: A1W0
0
1
0
1
0
1
0
1
DRAM CAS
Assertion Width
1
2
3
4
7
10
13
16
0
1
2
3
6
9
12
15 (Initial value)
Inserted Wait States
1
Description
Description
Synchronous DRAM
CAS Latency Cycles
Inhibited
1 *
2
3
4 *
5 *
Inhibited
Inhibited
2
2
2
RDY Pin
Ignored
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled

Related parts for HD6417750SBP200