KMSC7119VM1200 Freescale Semiconductor, KMSC7119VM1200 Datasheet - Page 19

• Manufacturer Part Number: KMSC7119VM1200
• Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MSC711x StarCorer
• Type: Fixed Pointr

Specifications of KMSC7119VM1200

• Interface: Host Interface, I²C, UART
• Clock Rate: 300MHz
• Non-volatile Memory: ROM (8 kB)
• On-chip Ram: 464kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: *
• Package / Case: 400-MAPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.3
Table 4 describes thermal characteristics of the MSC7119 for the MAP-BGA package.
Section 3.1, Thermal Design Considerations explains these characteristics in detail.
2.4
This section describes the DC electrical characteristics for the MSC7119.
Note:
Freescale Semiconductor
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board
Junction-to-case
Junction-to-package-top
Notes:
Core and PLL voltage
DRAM interface I/O voltage
I/O voltage
DRAM interface I/O reference voltage
DRAM interface I/O termination voltage
Input high CLKIN voltage
DRAM interface input high I/O voltage
DRAM interface input low I/O voltage
Input leakage current, V
V
REF
input leakage current
The leakage current is measured for nominal voltage values must vary in the same direction (for example, both
and
1.
2.
3.
4.
5.
6.
V
Thermal Characteristics
DC Electrical Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
DDC
5
4
1, 2
vary by +2 percent or both vary by –2 percent).
Characteristic
Characteristic
IN
6
= V
1
DDIO
Table 4. Thermal Characteristics for MAP-BGA Package
1, 3
2
3
Table 5. DC Electrical Characteristics
MSC7119 Data Sheet, Rev. 8
Symbol
V
V
V
V
V
I
V
V
DDPLL
V
Symbol
VTT
VREF
IHCLK
DDIO
DDC
DDM
I
REF
IHM
ILM
IN
R
R
R
R
Ψ
θJA
θJA
θJB
θJC
JT
0.49 × V
V
V
REF
REF
2.375
3.135
Min
1.14
–0.3
–1.0
Convection
2.4
—
+ 0.28
– 0.04
Natural
MAP-BGA 17
DDM
39
23
12
7
2
Typical
V
V
GND
1.25
0.09
1.2
2.5
3.3
3.0
DDM
REF
—
(1 m/s) airflow
×
200 ft/min
17 mm
31
20
Electrical Characteristics
5
0.51 × V
V
V
V
REF
REF
DDM
2.625
3.465
3.465
Max
1.26
1
5
+ 0.04
– 0.18
+ 0.3
DDM
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
V
µA
µA
V
V
V
V
V
V
V
V
DDIO
19