ADSP-BF538BBCZ-4F4 Analog Devices Inc, ADSP-BF538BBCZ-4F4 Datasheet - Page 2

• Manufacturer Part Number: ADSP-BF538BBCZ-4F4
• Description: IC, FLOAT-PT DSP, 16BIT, 400MHZ, BGA-316
• Manufacturer: Analog Devices Inc
• Series: Blackfinr
• Type: Fixed Pointr

Specifications of ADSP-BF538BBCZ-4F4

• No. Of Bits: 16 Bit
• Frequency: 400MHz
• Supply Voltage: 1.2V
• Embedded Interface Type: CAN, I2C, PPI, SPI, TWI, UART
• No. Of I/o's: 54
• Flash Memory Size: 512KB
• Interface: CAN, SPI, SSP, TWI, UART
• Clock Rate: 400MHz
• Non-volatile Memory: FLASH (512 kB)
• On-chip Ram: 148kB
• Voltage - I/o: 3.00V, 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 316-CSPBGA
• Device Core Size: 16b
• Architecture: Modified Harvard
• Format: Fixed Point
• Clock Freq (max): 400MHz
• Mips: 400
• Device Input Clock Speed: 400MHz
• Ram Size: 32KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/2.5/3.3V
• Operating Supply Voltage (min): 0.8/2.25/2.7V
• Operating Supply Voltage (max): 1.32/3.6V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 316
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADZS-BFAUDIO-EZEXT - BOARD EVAL AUDIO BLACKFIN
• Lead Free Status / Rohs Status: Compliant

ADSP-BF538/ADSP-BF538F
TABLE OF CONTENTS
General Description ................................................. 3
REVISION HISTORY
7/10—Rev. C to Rev. D
Corrected all document errata.
Updated information for Spansion S29AL008J in
(ADSP-BF538F8 Only) .............................................. 6
Changed maximum T
Conditions ........................................................... 23
Corrected minimum f
Timing ................................................................ 28
Replaced incorrect
Grant Cycle Timing with Synchronous BR ................... 34
Updated typical data for halogen-free package (reference PCN
09_0185) in
Replaced package drawing in
To view product/process change notifications (PCNs) related to
this data sheet revision, please visit the processor's product page
on the
Low Power Architecture ......................................... 3
System Integration ................................................ 3
ADSP-BF538/ADSP-BF538F Processor Peripherals ....... 3
Blackfin Processor Core .......................................... 4
Memory Architecture ............................................ 5
DMA Controllers .................................................. 8
Real-Time Clock ................................................... 9
Watchdog Timer .................................................. 9
Timers ............................................................... 9
Serial Ports (SPORTs) .......................................... 10
Serial Peripheral Interface (SPI) Ports ...................... 10
2-Wire Interface ................................................. 10
UART Ports ...................................................... 11
General-Purpose Ports ......................................... 11
Parallel Peripheral Interface ................................... 11
Controller Area Network (CAN) Interface ................ 12
Dynamic Power Management ................................ 13
Voltage Regulation .............................................. 14
Clock Signals ..................................................... 14
Booting Modes ................................................... 16
www.analog.com
Thermal Characteristics .......................... 52
Figure
J
CKIN
(junction temperature) in
website and use the View PCN link.
17,
data in
Outline Dimensions ......... 56
External Port Bus Request and
Table
21,
Clock and Reset
Flash Memory
Operating
Rev. D | Page 2 of 56 | July 2010
Pin Descriptions .................................................... 19
Specifications ........................................................ 23
316-Ball CSP_BGA Ball Assignment ........................... 53
Outline Dimensions ................................................ 56
Ordering Guide ..................................................... 56
Instruction Set Description .................................... 16
Development Tools .............................................. 17
Designing an Emulator Compatible Processor Board ... 18
Related Documents .............................................. 18
Related Signal Chains ........................................... 18
Operating Conditions ........................................... 23
Electrical Characteristics ....................................... 25
Absolute Maximum Ratings ................................... 27
ESD Sensitivity ................................................... 27
Package Information ............................................ 27
Timing Specifications ........................................... 28
Output Drive Currents ......................................... 46
Test Conditions .................................................. 48
Thermal Characteristics ........................................ 52
Surface-Mount Design .......................................... 56