ADSP-BF538BBCZ-4F4 Analog Devices Inc, ADSP-BF538BBCZ-4F4 Datasheet - Page 56

• Manufacturer Part Number: ADSP-BF538BBCZ-4F4
• Description: IC, FLOAT-PT DSP, 16BIT, 400MHZ, BGA-316
• Manufacturer: Analog Devices Inc
• Series: Blackfinr
• Type: Fixed Pointr

Specifications of ADSP-BF538BBCZ-4F4

• No. Of Bits: 16 Bit
• Frequency: 400MHz
• Supply Voltage: 1.2V
• Embedded Interface Type: CAN, I2C, PPI, SPI, TWI, UART
• No. Of I/o's: 54
• Flash Memory Size: 512KB
• Interface: CAN, SPI, SSP, TWI, UART
• Clock Rate: 400MHz
• Non-volatile Memory: FLASH (512 kB)
• On-chip Ram: 148kB
• Voltage - I/o: 3.00V, 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 316-CSPBGA
• Device Core Size: 16b
• Architecture: Modified Harvard
• Format: Fixed Point
• Clock Freq (max): 400MHz
• Mips: 400
• Device Input Clock Speed: 400MHz
• Ram Size: 32KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/2.5/3.3V
• Operating Supply Voltage (min): 0.8/2.25/2.7V
• Operating Supply Voltage (max): 1.32/3.6V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 316
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADZS-BFAUDIO-EZEXT - BOARD EVAL AUDIO BLACKFIN
• Lead Free Status / Rohs Status: Compliant

ADSP-BF538/ADSP-BF538F
OUTLINE DIMENSIONS
Dimensions in the outline dimensions figures are shown in millimeters.
SURFACE-MOUNT DESIGN
Table 44
design recommendations, refer to IPC-7351, Generic Requirements
for Surface-Mount Design and Land Pattern Standard.
Table 44. BGA Data for Use with Surface-Mount Design
ORDERING GUIDE
1
2
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Model
ADSP-BF538BBCZ-4A
ADSP-BF538BBCZ-5A
ADSP-BF538BBCZ-4F8
ADSP-BF538BBCZ-5F8
Package
316-Ball CSP_BGA (BC-316-2)
Z = RoHS compliant part.
Referenced temperature is ambient temperature.
1
is provided as an aid to PCB design. For industry-standard
CORNER
A1 BALL
Temperature
Range
–40°C to +85°C 400 MHz
–40°C to +85°C 533 MHz
–40°C to +85°C 400 MHz
–40°C to +85°C 533 MHz
1.45
1.36
1.27
2
Package Ball Attach Type
Solder Mask Defined
D06700-0-7/10(D)
Figure 57. 316-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
TOP VIEW
17.10
17.00 SQ
16.90
Instruction
Rate (Max)
COMPLIANT TO JEDEC STANDARDS MO-275-MMAB-1.
WITH EXCEPTION TO BALL DIAMETER.
Rev. D | Page 56 of 56 | July 2010
Dimensions shown in millimeters
Flash
Memory
N/A
N/A
8M bit
8M bit
SEATING
PLANE
(BC-316-2)
BSC SQ
15.20
Package Solder Mask Opening
0.40 mm diameter
BSC
0.80
Operating Voltage
(Nominal)
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball CSP_BGA
1.25 V internal, 2.5 V or 3.3 V I/O 316-Ball CSP_BGA
1.2 V internal, 3.0 V or 3.3 V I/O 316-Ball CSP_BGA
1.25 V internal, 3.0 V or 3.3 V I/O 316-Ball CSP_BGA
DETAIL A
20
19
BALL DIAMETER
18
17
16
15
BOTTOM VIEW
0.50
0.45
0.40
14
13
12
11
10
9
8
COPLANARITY
0.20
7
6
1.08
1.01
0.94
5
4
0.35 NOM
0.30 MIN
3
2
1
Package Description
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A1 BALL
CORNER
Package Ball Pad Size
0.50 mm diameter
Package
Option
BC-316-2
BC-316-2
BC-316-2
BC-316-2